641 lines
24 KiB
C++
641 lines
24 KiB
C++
/*
|
|
* This program source code file is part of KiCad, a free EDA CAD application.
|
|
*
|
|
* Copyright (C) 2014-2015 Mario Luzeiro <mrluzeiro@gmail.com>
|
|
* Copyright (C) 1992-2015 KiCad Developers, see AUTHORS.txt for contributors.
|
|
*
|
|
* This program is free software; you can redistribute it and/or
|
|
* modify it under the terms of the GNU General Public License
|
|
* as published by the Free Software Foundation; either version 2
|
|
* of the License, or (at your option) any later version.
|
|
*
|
|
* This program is distributed in the hope that it will be useful,
|
|
* but WITHOUT ANY WARRANTY; without even the implied warranty of
|
|
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
|
|
* GNU General Public License for more details.
|
|
*
|
|
* You should have received a copy of the GNU General Public License
|
|
* along with this program; if not, you may find one here:
|
|
* http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
|
|
* or you may search the http://www.gnu.org website for the version 2 license,
|
|
* or you may write to the Free Software Foundation, Inc.,
|
|
* 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
|
|
*/
|
|
|
|
/**
|
|
* @file 3d_draw_board_body.cpp
|
|
*
|
|
*/
|
|
|
|
#include <fctsys.h>
|
|
#include <common.h>
|
|
#include <trigo.h>
|
|
#include <pcbstruct.h>
|
|
#include <drawtxt.h>
|
|
#include <layers_id_colors_and_visibility.h>
|
|
|
|
#include <wxBasePcbFrame.h>
|
|
#include <class_board.h>
|
|
#include <class_module.h>
|
|
#include <class_track.h>
|
|
#include <class_edge_mod.h>
|
|
#include <class_zone.h>
|
|
#include <class_drawsegment.h>
|
|
#include <class_pcb_text.h>
|
|
#include <colors_selection.h>
|
|
#include <convert_basic_shapes_to_polygon.h>
|
|
#define GLM_FORCE_RADIANS
|
|
#include <gal/opengl/glm/gtc/matrix_transform.hpp>
|
|
#include <gal/opengl/opengl_compositor.h>
|
|
#ifdef __WINDOWS__
|
|
#include <GL/glew.h> // must be included before gl.h
|
|
#endif
|
|
|
|
#include <3d_viewer.h>
|
|
#include <3d_canvas.h>
|
|
#include <info3d_visu.h>
|
|
#include <trackball.h>
|
|
#include <3d_draw_basic_functions.h>
|
|
#include <geometry/shape_poly_set.h>
|
|
#include <geometry/shape_file_io.h>
|
|
|
|
|
|
#include <CImage.h>
|
|
#include <reporter.h>
|
|
|
|
// An option for all operations on polygons:
|
|
// when useFastModeForPolygons = true, calculations can be *a lot* faster.
|
|
// but created polygons can be not stricty simple (can share edges)
|
|
// Although stricty simple are better for glu tesselation functions, I do not see
|
|
// any issue when allowing not stricty simple polygons.
|
|
// But I see *very* long calculations when setting useFastMode to false.
|
|
// So, be careful if changing thie option
|
|
bool useFastModeForPolygons = true;
|
|
|
|
/* returns the Z orientation parameter 1.0 or -1.0 for aLayer
|
|
* Z orientation is 1.0 for all layers but "back" layers:
|
|
* B_Cu , B_Adhes, B_Paste ), B_SilkS
|
|
* used to calculate the Z orientation parameter for glNormal3f
|
|
*/
|
|
GLfloat Get3DLayer_Z_Orientation( LAYER_NUM aLayer );
|
|
|
|
void EDA_3D_CANVAS::buildBoardThroughHolesPolygonList( SHAPE_POLY_SET& allBoardHoles,
|
|
int aSegCountPerCircle, bool aOptimizeLargeCircles )
|
|
{
|
|
// hole diameter value to change seg count by circle:
|
|
int small_hole_limit = Millimeter2iu( 1.0 );
|
|
int copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();
|
|
|
|
BOARD* pcb = GetBoard();
|
|
|
|
// Build holes of through vias:
|
|
for( TRACK* track = pcb->m_Track; track; track = track->Next() )
|
|
{
|
|
if( track->Type() != PCB_VIA_T )
|
|
continue;
|
|
|
|
VIA *via = static_cast<VIA*>( track );
|
|
|
|
if( via->GetViaType() != VIA_THROUGH )
|
|
continue;
|
|
|
|
int holediameter = via->GetDrillValue();
|
|
int hole_outer_radius = (holediameter + copper_thickness) / 2;
|
|
|
|
TransformCircleToPolygon( allBoardHoles,
|
|
via->GetStart(), hole_outer_radius,
|
|
aSegCountPerCircle );
|
|
}
|
|
|
|
// Build holes of through pads:
|
|
for( MODULE* footprint = pcb->m_Modules; footprint; footprint = footprint->Next() )
|
|
{
|
|
for( D_PAD* pad = footprint->Pads(); pad; pad = pad->Next() )
|
|
{
|
|
// Calculate a factor to apply to segcount for large holes ( > 1 mm)
|
|
// (bigger pad drill size -> more segments) because holes in pads can have
|
|
// very different sizes and optimizing this segcount gives a better look
|
|
// Mainly mounting holes have a size bigger than small_hole_limit
|
|
wxSize padHole = pad->GetDrillSize();
|
|
|
|
if( ! padHole.x ) // Not drilled pad like SMD pad
|
|
continue;
|
|
|
|
// we use the hole diameter to calculate the seg count.
|
|
// for round holes, padHole.x == padHole.y
|
|
// for oblong holes, the diameter is the smaller of (padHole.x, padHole.y)
|
|
int diam = std::min( padHole.x, padHole.y );
|
|
int segcount = aSegCountPerCircle;
|
|
|
|
if( diam > small_hole_limit )
|
|
{
|
|
double segFactor = (double)diam / small_hole_limit;
|
|
segcount = (int)(aSegCountPerCircle * segFactor);
|
|
|
|
// limit segcount to 48. For a circle this is a very good approx.
|
|
if( segcount > 48 )
|
|
segcount = 48;
|
|
}
|
|
|
|
// The hole in the body is inflated by copper thickness.
|
|
int inflate = copper_thickness;
|
|
|
|
// If not plated, no copper.
|
|
if( pad->GetAttribute () == PAD_ATTRIB_HOLE_NOT_PLATED )
|
|
inflate = 0;
|
|
|
|
pad->BuildPadDrillShapePolygon( allBoardHoles, inflate, segcount );
|
|
}
|
|
}
|
|
|
|
allBoardHoles.Simplify( useFastModeForPolygons );
|
|
}
|
|
|
|
|
|
void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList,
|
|
REPORTER* aErrorMessages, REPORTER* aActivity )
|
|
{
|
|
BOARD* pcb = GetBoard();
|
|
|
|
// If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas.
|
|
// If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas,
|
|
// but the calculation time is twice shorter.
|
|
bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES );
|
|
|
|
bool realistic_mode = isRealisticMode();
|
|
bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );
|
|
|
|
// Number of segments to convert a circle to polygon
|
|
// We use 2 values: the first gives a good shape (for instanes rond pads)
|
|
// the second is used to speed up calculations, when a poor approximation is acceptable (holes)
|
|
const int segcountforcircle = 18;
|
|
double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2.0) );
|
|
const int segcountLowQuality = 12; // segments to draw a circle with low quality
|
|
// to reduce time calculations
|
|
// for holes and items which do not need
|
|
// a fine representation
|
|
double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) );
|
|
|
|
SHAPE_POLY_SET bufferPolys; // copper areas: tracks, pads and filled zones areas
|
|
// when holes are removed from zones
|
|
SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines
|
|
SHAPE_POLY_SET bufferZonesPolys; // copper filled zones areas
|
|
// when holes are not removed from zones
|
|
SHAPE_POLY_SET currLayerHoles; // Contains holes for the current layer
|
|
SHAPE_POLY_SET allLayerHoles; // Contains holes for all layers
|
|
|
|
// Build a polygon from edge cut items
|
|
wxString msg;
|
|
|
|
if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
|
|
{
|
|
if( aErrorMessages )
|
|
{
|
|
msg << wxT("\n") << _("Unable to calculate the board outlines.\n"
|
|
"Therefore use the board boundary box.") << wxT("\n\n");
|
|
|
|
aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
|
|
}
|
|
}
|
|
|
|
// Build board holes, with optimization of large holes shape.
|
|
buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true );
|
|
|
|
LSET cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount );
|
|
|
|
glNewList( aBoardList, GL_COMPILE );
|
|
|
|
for( LSEQ cu = cu_set.CuStack(); cu; ++cu )
|
|
{
|
|
LAYER_ID layer = *cu;
|
|
|
|
// Skip non enabled layers in normal mode,
|
|
// and internal layers in realistic mode
|
|
if( !is3DLayerEnabled( layer ) )
|
|
continue;
|
|
|
|
if( aActivity )
|
|
aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );
|
|
|
|
bufferPolys.RemoveAllContours();
|
|
bufferZonesPolys.RemoveAllContours();
|
|
currLayerHoles.RemoveAllContours();
|
|
|
|
// Draw track shapes:
|
|
for( TRACK* track = pcb->m_Track; track; track = track->Next() )
|
|
{
|
|
if( !track->IsOnLayer( layer ) )
|
|
continue;
|
|
|
|
track->TransformShapeWithClearanceToPolygon( bufferPolys,
|
|
0, segcountforcircle,
|
|
correctionFactor );
|
|
|
|
// Add blind/buried via holes
|
|
if( track->Type() == PCB_VIA_T )
|
|
{
|
|
VIA *via = static_cast<VIA*>( track );
|
|
|
|
if( via->GetViaType() == VIA_THROUGH )
|
|
continue; // already done
|
|
|
|
int holediameter = via->GetDrillValue();
|
|
int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
|
|
int hole_outer_radius = (holediameter + thickness) / 2;
|
|
|
|
TransformCircleToPolygon( currLayerHoles,
|
|
via->GetStart(), hole_outer_radius,
|
|
segcountLowQuality );
|
|
}
|
|
}
|
|
|
|
// draw pad shapes
|
|
for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
|
|
{
|
|
// Note: NPTH pads are not drawn on copper layers when the pad
|
|
// has same shape as its hole
|
|
module->TransformPadsShapesWithClearanceToPolygon( layer,
|
|
bufferPolys,
|
|
0,
|
|
segcountforcircle,
|
|
correctionFactor, true );
|
|
|
|
// Micro-wave modules may have items on copper layers
|
|
module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
|
|
bufferPolys,
|
|
0,
|
|
segcountforcircle,
|
|
correctionFactor );
|
|
|
|
// pad holes are already in list.
|
|
}
|
|
|
|
// Draw copper zones. Note:
|
|
// * if the holes are removed from copper zones
|
|
// the polygons are stored in bufferPolys (which contains all other polygons)
|
|
// * if the holes are NOT removed from copper zones
|
|
// the polygons are stored in bufferZonesPolys
|
|
if( isEnabled( FL_ZONE ) )
|
|
{
|
|
for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
|
|
{
|
|
ZONE_CONTAINER* zone = pcb->GetArea( ii );
|
|
LAYER_NUM zonelayer = zone->GetLayer();
|
|
|
|
if( zonelayer == layer )
|
|
{
|
|
zone->TransformSolidAreasShapesToPolygonSet(
|
|
remove_Holes ? bufferPolys : bufferZonesPolys,
|
|
segcountLowQuality, correctionFactorLQ );
|
|
}
|
|
}
|
|
}
|
|
|
|
// draw graphic items on copper layers (texts)
|
|
for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
|
|
{
|
|
if( !item->IsOnLayer( layer ) )
|
|
continue;
|
|
|
|
switch( item->Type() )
|
|
{
|
|
case PCB_LINE_T: // should not exist on copper layers
|
|
( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
|
|
bufferPolys, 0, segcountforcircle, correctionFactor );
|
|
break;
|
|
|
|
case PCB_TEXT_T:
|
|
( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
|
|
bufferPolys, 0, segcountLowQuality, correctionFactor );
|
|
break;
|
|
|
|
default:
|
|
break;
|
|
}
|
|
}
|
|
|
|
// bufferPolys contains polygons to merge. Many overlaps .
|
|
// Calculate merged polygons
|
|
if( bufferPolys.IsEmpty() )
|
|
continue;
|
|
|
|
// Use Clipper lib to subtract holes to copper areas
|
|
if( currLayerHoles.OutlineCount() )
|
|
{
|
|
currLayerHoles.Append(allLayerHoles);
|
|
currLayerHoles.Simplify( useFastModeForPolygons );
|
|
bufferPolys.BooleanSubtract( currLayerHoles, useFastModeForPolygons );
|
|
}
|
|
else
|
|
bufferPolys.BooleanSubtract( allLayerHoles, useFastModeForPolygons );
|
|
|
|
int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
|
|
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
|
|
|
|
float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)
|
|
|
|
// If we are not using thickness, then the z-normal has to match the layer direction
|
|
// because just one plane will be drawn
|
|
if( !thickness )
|
|
zNormal = Get3DLayer_Z_Orientation( layer );
|
|
|
|
if( realistic_mode )
|
|
{
|
|
setGLCopperColor();
|
|
}
|
|
else
|
|
{
|
|
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( layer );
|
|
SetGLColor( color );
|
|
}
|
|
|
|
// If holes are removed from copper zones, bufferPolys contains all polygons
|
|
// to draw (tracks+zones+texts).
|
|
Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness,
|
|
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
|
|
zNormal );
|
|
|
|
// If holes are not removed from copper zones (for calculation time reasons,
|
|
// the zone polygons are stored in bufferZonesPolys and have to be drawn now:
|
|
if( !bufferZonesPolys.IsEmpty() )
|
|
{
|
|
Draw3D_SolidHorizontalPolyPolygons( bufferZonesPolys, zpos, thickness,
|
|
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
|
|
zNormal );
|
|
}
|
|
}
|
|
|
|
if( aActivity )
|
|
aActivity->Report( _( "Build board body" ) );
|
|
|
|
// Draw plated vertical holes inside the board, but not always. They are drawn:
|
|
// - if the board body is not shown, to show the holes.
|
|
// - or if the copper thickness is shown
|
|
if( !isEnabled( FL_SHOW_BOARD_BODY ) || isEnabled( FL_USE_COPPER_THICKNESS ) )
|
|
{
|
|
// Draw vias holes (vertical cylinders)
|
|
for( const TRACK* track = pcb->m_Track; track; track = track->Next() )
|
|
{
|
|
if( track->Type() == PCB_VIA_T )
|
|
{
|
|
const VIA *via = static_cast<const VIA*>(track);
|
|
draw3DViaHole( via );
|
|
}
|
|
}
|
|
|
|
// Draw pads holes (vertical cylinders)
|
|
for( const MODULE* module = pcb->m_Modules; module; module = module->Next() )
|
|
{
|
|
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
|
|
if( pad->GetAttribute () != PAD_ATTRIB_HOLE_NOT_PLATED )
|
|
draw3DPadHole( pad );
|
|
}
|
|
}
|
|
|
|
glEndList();
|
|
|
|
// Build the body board:
|
|
glNewList( aBodyOnlyList, GL_COMPILE );
|
|
|
|
if( isRealisticMode() )
|
|
{
|
|
setGLEpoxyColor( 1.00 );
|
|
}
|
|
else
|
|
{
|
|
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( Edge_Cuts );
|
|
SetGLColor( color, 0.7 );
|
|
}
|
|
|
|
float copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();
|
|
|
|
// a small offset between substrate and external copper layer to avoid artifacts
|
|
// when drawing copper items on board
|
|
float epsilon = Millimeter2iu( 0.01 );
|
|
float zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
|
|
float board_thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
|
|
- GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
|
|
|
|
// items on copper layers and having a thickness = copper_thickness
|
|
// are drawn from zpos - copper_thickness/2 to zpos + copper_thickness
|
|
// therefore substrate position is copper_thickness/2 to
|
|
// substrate_height - copper_thickness/2
|
|
zpos += (copper_thickness + epsilon) / 2.0f;
|
|
board_thickness -= copper_thickness + epsilon;
|
|
|
|
bufferPcbOutlines.BooleanSubtract( allLayerHoles, useFastModeForPolygons );
|
|
|
|
if( !bufferPcbOutlines.IsEmpty() )
|
|
{
|
|
Draw3D_SolidHorizontalPolyPolygons( bufferPcbOutlines, zpos + board_thickness / 2.0,
|
|
board_thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
|
|
1.0f );
|
|
}
|
|
|
|
glEndList();
|
|
}
|
|
|
|
|
|
void EDA_3D_CANVAS::buildTechLayers3DView( REPORTER* aErrorMessages, REPORTER* aActivity )
|
|
{
|
|
BOARD* pcb = GetBoard();
|
|
bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );
|
|
|
|
// Number of segments to draw a circle using segments
|
|
const int segcountforcircle = 18;
|
|
double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2) );
|
|
const int segcountLowQuality = 12; // segments to draw a circle with low quality
|
|
// to reduce time calculations
|
|
// for holes and items which do not need
|
|
// a fine representation
|
|
|
|
double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2) );
|
|
|
|
// segments to draw a circle to build texts. Is is used only to build
|
|
// the shape of each segment of the stroke font, therefore no need to have
|
|
// many segments per circle.
|
|
const int segcountInStrokeFont = 8;
|
|
|
|
SHAPE_POLY_SET bufferPolys;
|
|
SHAPE_POLY_SET allLayerHoles; // Contains through holes, calculated only once
|
|
SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines
|
|
|
|
// Build a polygon from edge cut items
|
|
wxString msg;
|
|
|
|
if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
|
|
{
|
|
if( aErrorMessages )
|
|
{
|
|
msg << wxT("\n") <<
|
|
_("Unable to calculate the board outlines.\n"
|
|
"Therefore use the board boundary box.") << wxT("\n\n");
|
|
aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
|
|
}
|
|
}
|
|
|
|
// Build board holes, with no optimization of large holes shape.
|
|
buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, false );
|
|
|
|
// draw graphic items, on technical layers
|
|
|
|
static const LAYER_ID teckLayerList[] = {
|
|
B_Adhes,
|
|
F_Adhes,
|
|
B_Paste,
|
|
F_Paste,
|
|
B_SilkS,
|
|
F_SilkS,
|
|
B_Mask,
|
|
F_Mask,
|
|
};
|
|
|
|
// User layers are not drawn here, only technical layers
|
|
for( LSEQ seq = LSET::AllTechMask().Seq( teckLayerList, DIM( teckLayerList ) ); seq; ++seq )
|
|
{
|
|
LAYER_ID layer = *seq;
|
|
|
|
if( !is3DLayerEnabled( layer ) )
|
|
continue;
|
|
|
|
if( layer == Edge_Cuts && isEnabled( FL_SHOW_BOARD_BODY ) )
|
|
continue;
|
|
|
|
if( aActivity )
|
|
aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );
|
|
|
|
bufferPolys.RemoveAllContours();
|
|
|
|
for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
|
|
{
|
|
if( !item->IsOnLayer( layer ) )
|
|
continue;
|
|
|
|
switch( item->Type() )
|
|
{
|
|
case PCB_LINE_T:
|
|
( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
|
|
bufferPolys, 0, segcountforcircle, correctionFactor );
|
|
break;
|
|
|
|
case PCB_TEXT_T:
|
|
( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
|
|
bufferPolys, 0, segcountLowQuality, 1.0 );
|
|
break;
|
|
|
|
default:
|
|
break;
|
|
}
|
|
}
|
|
|
|
for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
|
|
{
|
|
if( layer == F_SilkS || layer == B_SilkS )
|
|
{
|
|
// On silk screen layers, the pad shape is only the pad outline
|
|
// never a filled shape
|
|
D_PAD* pad = module->Pads();
|
|
int linewidth = g_DrawDefaultLineThickness;
|
|
|
|
for( ; pad; pad = pad->Next() )
|
|
{
|
|
if( !pad->IsOnLayer( layer ) )
|
|
continue;
|
|
|
|
buildPadShapeThickOutlineAsPolygon( pad, bufferPolys,
|
|
linewidth, segcountforcircle, correctionFactor );
|
|
}
|
|
}
|
|
else
|
|
module->TransformPadsShapesWithClearanceToPolygon( layer,
|
|
bufferPolys, 0, segcountforcircle, correctionFactor );
|
|
|
|
// On tech layers, use a poor circle approximation, only for texts (stroke font)
|
|
module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
|
|
bufferPolys, 0, segcountforcircle, correctionFactor, segcountInStrokeFont );
|
|
}
|
|
|
|
// Draw non copper zones
|
|
if( isEnabled( FL_ZONE ) )
|
|
{
|
|
for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
|
|
{
|
|
ZONE_CONTAINER* zone = pcb->GetArea( ii );
|
|
|
|
if( !zone->IsOnLayer( layer ) )
|
|
continue;
|
|
|
|
zone->TransformSolidAreasShapesToPolygonSet(
|
|
bufferPolys, segcountLowQuality, correctionFactorLQ );
|
|
}
|
|
}
|
|
|
|
// bufferPolys contains polygons to merge. Many overlaps .
|
|
// Calculate merged polygons and remove pads and vias holes
|
|
if( layer != B_Mask && layer != F_Mask && bufferPolys.IsEmpty() )
|
|
// if a layer has no iten to draw, skip it
|
|
// However solder mask layers are negative layers, so no item
|
|
// means only a full layer mask
|
|
continue;
|
|
|
|
// Solder mask layers are "negative" layers.
|
|
// Shapes should be removed from the full board area.
|
|
if( layer == B_Mask || layer == F_Mask )
|
|
{
|
|
SHAPE_POLY_SET cuts = bufferPolys;
|
|
bufferPolys = bufferPcbOutlines;
|
|
|
|
cuts.Append(allLayerHoles);
|
|
cuts.Simplify( useFastModeForPolygons );
|
|
|
|
bufferPolys.BooleanSubtract( cuts, useFastModeForPolygons );
|
|
}
|
|
// Remove holes from Solder paste layers and silkscreen
|
|
else if( layer == B_Paste || layer == F_Paste
|
|
|| layer == B_SilkS || layer == F_SilkS )
|
|
{
|
|
bufferPolys.BooleanSubtract( allLayerHoles, useFastModeForPolygons );
|
|
}
|
|
|
|
int thickness = 0;
|
|
|
|
if( layer != B_Mask && layer != F_Mask )
|
|
thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
|
|
|
|
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
|
|
|
|
if( layer == Edge_Cuts )
|
|
{
|
|
thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
|
|
- GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
|
|
zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu )
|
|
+ (thickness / 2);
|
|
}
|
|
else
|
|
{
|
|
// for Draw3D_SolidHorizontalPolyPolygons, zpos it the middle between bottom and top
|
|
// sides.
|
|
// However for top layers, zpos should be the bottom layer pos,
|
|
// and for bottom layers, zpos should be the top layer pos.
|
|
if( Get3DLayer_Z_Orientation( layer ) > 0 )
|
|
zpos += thickness/2;
|
|
else
|
|
zpos -= thickness/2 ;
|
|
}
|
|
|
|
|
|
float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)
|
|
|
|
// If we are not using thickness, then the znormal must face the layer direction
|
|
// because it will draw just one plane
|
|
if( !thickness )
|
|
zNormal = Get3DLayer_Z_Orientation( layer );
|
|
|
|
|
|
setGLTechLayersColor( layer );
|
|
Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos,
|
|
thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
|
|
zNormal );
|
|
}
|
|
}
|