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kicad/3d-viewer/3d_canvas/create_layer_items.cpp

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/*
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2015-2016 Mario Luzeiro <mrluzeiro@ua.pt>
* Copyright (C) 1992-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
* as published by the Free Software Foundation; either version 2
* of the License, or (at your option) any later version.
*
* This program is distributed in the hope that it will be useful,
* but WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
* GNU General Public License for more details.
*
* You should have received a copy of the GNU General Public License
* along with this program; if not, you may find one here:
* http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
* or you may search the http://www.gnu.org website for the version 2 license,
* or you may write to the Free Software Foundation, Inc.,
* 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
*/
/**
* @file create_layer_items.cpp
* @brief This file implements the creation of the pcb board.
*
* It is based on the function found in the files:
* board_items_to_polygon_shape_transform.cpp
* board_items_to_polygon_shape_transform.cpp
*/
#include "board_adapter.h"
#include "../3d_rendering/raytracing/shapes2D/filled_circle_2d.h"
#include <board_design_settings.h>
#include <footprint.h>
#include <pad.h>
#include <pcb_text.h>
#include <fp_shape.h>
#include <zone.h>
#include <convert_basic_shapes_to_polygon.h>
#include <trigo.h>
#include <vector>
#include <thread>
#include <core/arraydim.h>
#include <algorithm>
#include <atomic>
#include <wx/log.h>
#ifdef PRINT_STATISTICS_3D_VIEWER
#include <profile.h>
#endif
void BOARD_ADAPTER::destroyLayers()
{
if( !m_layers_poly.empty() )
{
for( auto& poly : m_layers_poly )
delete poly.second;
m_layers_poly.clear();
}
delete m_frontPlatedPadPolys;
m_frontPlatedPadPolys = nullptr;
delete m_backPlatedPadPolys;
m_backPlatedPadPolys = nullptr;
if( !m_layerHoleIdPolys.empty() )
{
for( auto& poly : m_layerHoleIdPolys )
delete poly.second;
m_layerHoleIdPolys.clear();
}
if( !m_layerHoleOdPolys.empty() )
{
for( auto& poly : m_layerHoleOdPolys )
delete poly.second;
m_layerHoleOdPolys.clear();
}
if( !m_layerMap.empty() )
{
for( auto& poly : m_layerMap )
delete poly.second;
m_layerMap.clear();
}
delete m_platedPadsFront;
m_platedPadsFront = nullptr;
delete m_platedPadsBack;
m_platedPadsBack = nullptr;
if( !m_layerHoleMap.empty() )
{
for( auto& poly : m_layerHoleMap )
delete poly.second;
m_layerHoleMap.clear();
}
m_throughHoleIds.Clear();
m_throughHoleOds.Clear();
m_throughHoleAnnularRings.Clear();
m_throughHoleViaOds.Clear();
m_throughHoleViaIds.Clear();
m_nonPlatedThroughHoleOdPolys.RemoveAllContours();
m_throughHoleOdPolys.RemoveAllContours();
m_throughHoleViaOdPolys.RemoveAllContours();
m_throughHoleAnnularRingPolys.RemoveAllContours();
}
void BOARD_ADAPTER::createLayers( REPORTER* aStatusReporter )
{
destroyLayers();
// Build Copper layers
// Based on:
// https://github.com/KiCad/kicad-source-mirror/blob/master/3d-viewer/3d_draw.cpp#L692
#ifdef PRINT_STATISTICS_3D_VIEWER
unsigned stats_startCopperLayersTime = GetRunningMicroSecs();
unsigned start_Time = stats_startCopperLayersTime;
#endif
PCB_LAYER_ID cu_seq[MAX_CU_LAYERS];
LSET cu_set = LSET::AllCuMask( m_copperLayersCount );
m_trackCount = 0;
m_averageTrackWidth = 0;
m_viaCount = 0;
m_averageViaHoleDiameter = 0;
m_holeCount = 0;
m_averageHoleDiameter = 0;
if( !m_board )
return;
// Prepare track list, convert in a vector. Calc statistic for the holes
std::vector<const PCB_TRACK*> trackList;
trackList.clear();
trackList.reserve( m_board->Tracks().size() );
for( PCB_TRACK* track : m_board->Tracks() )
{
if( !Is3dLayerEnabled( track->GetLayer() ) ) // Skip non enabled layers
continue;
// Note: a PCB_TRACK holds normal segment tracks and also vias circles (that have also
// drill values)
trackList.push_back( track );
if( track->Type() == PCB_VIA_T )
{
const PCB_VIA *via = static_cast< const PCB_VIA*>( track );
m_viaCount++;
m_averageViaHoleDiameter += via->GetDrillValue() * m_biuTo3Dunits;
}
else
{
m_trackCount++;
}
m_averageTrackWidth += track->GetWidth() * m_biuTo3Dunits;
}
if( m_trackCount )
m_averageTrackWidth /= (float)m_trackCount;
if( m_viaCount )
m_averageViaHoleDiameter /= (float)m_viaCount;
// Prepare copper layers index and containers
std::vector< PCB_LAYER_ID > layer_id;
layer_id.clear();
layer_id.reserve( m_copperLayersCount );
for( unsigned i = 0; i < arrayDim( cu_seq ); ++i )
cu_seq[i] = ToLAYER_ID( B_Cu - i );
for( LSEQ cu = cu_set.Seq( cu_seq, arrayDim( cu_seq ) ); cu; ++cu )
{
const PCB_LAYER_ID curr_layer_id = *cu;
if( !Is3dLayerEnabled( curr_layer_id ) ) // Skip non enabled layers
continue;
layer_id.push_back( curr_layer_id );
BVH_CONTAINER_2D *layerContainer = new BVH_CONTAINER_2D;
m_layerMap[curr_layer_id] = layerContainer;
if( m_Cfg->m_Render.opengl_copper_thickness
&& m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL )
{
SHAPE_POLY_SET* layerPoly = new SHAPE_POLY_SET;
m_layers_poly[curr_layer_id] = layerPoly;
}
}
if( m_Cfg->m_Render.renderPlatedPadsAsPlated && m_Cfg->m_Render.realistic )
{
m_frontPlatedPadPolys = new SHAPE_POLY_SET;
m_backPlatedPadPolys = new SHAPE_POLY_SET;
m_platedPadsFront = new BVH_CONTAINER_2D;
m_platedPadsBack = new BVH_CONTAINER_2D;
}
if( aStatusReporter )
aStatusReporter->Report( _( "Create tracks and vias" ) );
// Create tracks as objects and add it to container
for( PCB_LAYER_ID curr_layer_id : layer_id )
{
wxASSERT( m_layerMap.find( curr_layer_id ) != m_layerMap.end() );
BVH_CONTAINER_2D *layerContainer = m_layerMap[curr_layer_id];
// Add track segments shapes and via annulus shapes
unsigned int nTracks = trackList.size();
for( unsigned int trackIdx = 0; trackIdx < nTracks; ++trackIdx )
{
const PCB_TRACK *track = trackList[trackIdx];
// NOTE: Vias can be on multiple layers
if( !track->IsOnLayer( curr_layer_id ) )
continue;
// Skip vias annulus when not connected on this layer (if removing is enabled)
const PCB_VIA *via = dyn_cast< const PCB_VIA*>( track );
if( via && !via->FlashLayer( curr_layer_id ) && IsCopperLayer( curr_layer_id ) )
continue;
// Add object item to layer container
createTrack( track, layerContainer, 0.0f );
}
}
// Create VIAS and THTs objects and add it to holes containers
for( PCB_LAYER_ID curr_layer_id : layer_id )
{
// ADD TRACKS
unsigned int nTracks = trackList.size();
for( unsigned int trackIdx = 0; trackIdx < nTracks; ++trackIdx )
{
const PCB_TRACK *track = trackList[trackIdx];
if( !track->IsOnLayer( curr_layer_id ) )
continue;
// ADD VIAS and THT
if( track->Type() == PCB_VIA_T )
{
const PCB_VIA* via = static_cast<const PCB_VIA*>( track );
const VIATYPE viatype = via->GetViaType();
const float holediameter = via->GetDrillValue() * BiuTo3dUnits();
// holes and layer copper extend half info cylinder wall to hide transition
const float thickness = GetHolePlatingThickness() * BiuTo3dUnits() / 2.0f;
const float hole_inner_radius = holediameter / 2.0f;
const float ring_radius = via->GetWidth() * BiuTo3dUnits() / 2.0f;
const SFVEC2F via_center( via->GetStart().x * m_biuTo3Dunits,
-via->GetStart().y * m_biuTo3Dunits );
if( viatype != VIATYPE::THROUGH )
{
// Add hole objects
BVH_CONTAINER_2D *layerHoleContainer = nullptr;
// Check if the layer is already created
if( m_layerHoleMap.find( curr_layer_id ) == m_layerHoleMap.end() )
{
// not found, create a new container
layerHoleContainer = new BVH_CONTAINER_2D;
m_layerHoleMap[curr_layer_id] = layerHoleContainer;
}
else
{
// found
layerHoleContainer = m_layerHoleMap[curr_layer_id];
}
// Add a hole for this layer
layerHoleContainer->Add( new FILLED_CIRCLE_2D( via_center,
hole_inner_radius + thickness,
*track ) );
}
else if( curr_layer_id == layer_id[0] ) // it only adds once the THT holes
{
// Add through hole object
m_throughHoleOds.Add( new FILLED_CIRCLE_2D( via_center,
hole_inner_radius + thickness,
*track ) );
m_throughHoleViaOds.Add( new FILLED_CIRCLE_2D( via_center,
hole_inner_radius + thickness,
*track ) );
if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic )
{
m_throughHoleAnnularRings.Add( new FILLED_CIRCLE_2D( via_center,
ring_radius,
*track ) );
}
m_throughHoleIds.Add( new FILLED_CIRCLE_2D( via_center, hole_inner_radius,
*track ) );
}
}
}
}
// Create VIAS and THTs objects and add it to holes containers
for( PCB_LAYER_ID curr_layer_id : layer_id )
{
// ADD TRACKS
const unsigned int nTracks = trackList.size();
for( unsigned int trackIdx = 0; trackIdx < nTracks; ++trackIdx )
{
const PCB_TRACK *track = trackList[trackIdx];
if( !track->IsOnLayer( curr_layer_id ) )
continue;
// ADD VIAS and THT
if( track->Type() == PCB_VIA_T )
{
const PCB_VIA* via = static_cast<const PCB_VIA*>( track );
const VIATYPE viatype = via->GetViaType();
if( viatype != VIATYPE::THROUGH )
{
// Add PCB_VIA hole contours
// Add outer holes of VIAs
SHAPE_POLY_SET *layerOuterHolesPoly = nullptr;
SHAPE_POLY_SET *layerInnerHolesPoly = nullptr;
// Check if the layer is already created
if( m_layerHoleOdPolys.find( curr_layer_id ) ==
m_layerHoleOdPolys.end() )
{
// not found, create a new container
layerOuterHolesPoly = new SHAPE_POLY_SET;
m_layerHoleOdPolys[curr_layer_id] = layerOuterHolesPoly;
wxASSERT( m_layerHoleIdPolys.find( curr_layer_id ) ==
m_layerHoleIdPolys.end() );
layerInnerHolesPoly = new SHAPE_POLY_SET;
m_layerHoleIdPolys[curr_layer_id] = layerInnerHolesPoly;
}
else
{
// found
layerOuterHolesPoly = m_layerHoleOdPolys[curr_layer_id];
wxASSERT( m_layerHoleIdPolys.find( curr_layer_id ) !=
m_layerHoleIdPolys.end() );
layerInnerHolesPoly = m_layerHoleIdPolys[curr_layer_id];
}
const int holediameter = via->GetDrillValue();
const int hole_outer_radius = (holediameter / 2) + GetHolePlatingThickness();
TransformCircleToPolygon( *layerOuterHolesPoly, via->GetStart(),
hole_outer_radius, ARC_HIGH_DEF, ERROR_INSIDE );
TransformCircleToPolygon( *layerInnerHolesPoly, via->GetStart(),
holediameter / 2, ARC_HIGH_DEF, ERROR_INSIDE );
}
else if( curr_layer_id == layer_id[0] ) // it only adds once the THT holes
{
const int holediameter = via->GetDrillValue();
const int hole_outer_radius = (holediameter / 2) + GetHolePlatingThickness();
const int hole_outer_ring_radius = via->GetWidth() / 2.0f;
// Add through hole contours
TransformCircleToPolygon( m_throughHoleOdPolys, via->GetStart(),
hole_outer_radius, ARC_HIGH_DEF, ERROR_INSIDE );
// Add same thing for vias only
TransformCircleToPolygon( m_throughHoleViaOdPolys, via->GetStart(),
hole_outer_radius, ARC_HIGH_DEF, ERROR_INSIDE );
if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic )
{
TransformCircleToPolygon( m_throughHoleAnnularRingPolys, via->GetStart(),
hole_outer_ring_radius, ARC_HIGH_DEF,
ERROR_INSIDE );
}
}
}
}
}
// Creates vertical outline contours of the tracks and add it to the poly of the layer
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL )
{
for( PCB_LAYER_ID curr_layer_id : layer_id )
{
wxASSERT( m_layers_poly.find( curr_layer_id ) != m_layers_poly.end() );
SHAPE_POLY_SET *layerPoly = m_layers_poly[curr_layer_id];
// ADD TRACKS
unsigned int nTracks = trackList.size();
for( unsigned int trackIdx = 0; trackIdx < nTracks; ++trackIdx )
{
const PCB_TRACK *track = trackList[trackIdx];
if( !track->IsOnLayer( curr_layer_id ) )
continue;
// Skip vias annulus when not connected on this layer (if removing is enabled)
const PCB_VIA *via = dyn_cast<const PCB_VIA*>( track );
if( via && !via->FlashLayer( curr_layer_id ) && IsCopperLayer( curr_layer_id ) )
continue;
// Add the track/via contour
track->TransformShapeWithClearanceToPolygon( *layerPoly, curr_layer_id, 0,
ARC_HIGH_DEF, ERROR_INSIDE );
}
}
}
// Add holes of footprints
for( FOOTPRINT* footprint : m_board->Footprints() )
{
for( PAD* pad : footprint->Pads() )
{
const VECTOR2I padHole = pad->GetDrillSize();
if( !padHole.x ) // Not drilled pad like SMD pad
continue;
// The hole in the body is inflated by copper thickness, if not plated, no copper
const int inflate = ( pad->GetAttribute () != PAD_ATTRIB::NPTH ) ?
GetHolePlatingThickness() / 2 : 0;
m_holeCount++;
m_averageHoleDiameter += ( ( pad->GetDrillSize().x +
pad->GetDrillSize().y ) / 2.0f ) * m_biuTo3Dunits;
m_throughHoleOds.Add( createPadWithDrill( pad, inflate ) );
if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic )
m_throughHoleAnnularRings.Add( createPadWithDrill( pad, inflate ) );
m_throughHoleIds.Add( createPadWithDrill( pad, 0 ) );
}
}
if( m_holeCount )
m_averageHoleDiameter /= (float)m_holeCount;
// Add contours of the pad holes (pads can be Circle or Segment holes)
for( FOOTPRINT* footprint : m_board->Footprints() )
{
for( PAD* pad : footprint->Pads() )
{
const VECTOR2I padHole = pad->GetDrillSize();
if( !padHole.x ) // Not drilled pad like SMD pad
continue;
// The hole in the body is inflated by copper thickness.
const int inflate = GetHolePlatingThickness();
if( pad->GetAttribute () != PAD_ATTRIB::NPTH )
{
if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic )
{
pad->TransformHoleWithClearanceToPolygon( m_throughHoleAnnularRingPolys,
inflate, ARC_HIGH_DEF, ERROR_INSIDE );
}
pad->TransformHoleWithClearanceToPolygon( m_throughHoleOdPolys, inflate,
ARC_HIGH_DEF, ERROR_INSIDE );
}
else
{
// If not plated, no copper.
if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic )
{
pad->TransformHoleWithClearanceToPolygon( m_throughHoleAnnularRingPolys, 0,
ARC_HIGH_DEF, ERROR_INSIDE );
}
pad->TransformHoleWithClearanceToPolygon( m_nonPlatedThroughHoleOdPolys, 0,
ARC_HIGH_DEF, ERROR_INSIDE );
}
}
}
const bool renderPlatedPadsAsPlated = m_Cfg->m_Render.renderPlatedPadsAsPlated
&& m_Cfg->m_Render.realistic;
// Add footprints PADs objects to containers
for( PCB_LAYER_ID curr_layer_id : layer_id )
{
wxASSERT( m_layerMap.find( curr_layer_id ) != m_layerMap.end() );
BVH_CONTAINER_2D *layerContainer = m_layerMap[curr_layer_id];
// ADD PADS
for( FOOTPRINT* footprint : m_board->Footprints() )
{
// Note: NPTH pads are not drawn on copper layers when the pad has the same shape
// as its hole
addPadsWithClearance( footprint, layerContainer, curr_layer_id, 0, true,
renderPlatedPadsAsPlated, false );
// Micro-wave footprints may have items on copper layers
addFootprintShapesWithClearance( footprint, layerContainer, curr_layer_id, 0 );
}
}
if( renderPlatedPadsAsPlated )
{
// ADD PLATED PADS
for( FOOTPRINT* footprint : m_board->Footprints() )
{
addPadsWithClearance( footprint, m_platedPadsFront, F_Cu, 0, true, false, true );
addPadsWithClearance( footprint, m_platedPadsBack, B_Cu, 0, true, false, true );
}
m_platedPadsFront->BuildBVH();
m_platedPadsBack->BuildBVH();
}
// Add footprints PADs poly contours (vertical outlines)
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL )
{
for( PCB_LAYER_ID curr_layer_id : layer_id )
{
wxASSERT( m_layers_poly.find( curr_layer_id ) != m_layers_poly.end() );
SHAPE_POLY_SET *layerPoly = m_layers_poly[curr_layer_id];
// Add pads to polygon list
for( FOOTPRINT* footprint : m_board->Footprints() )
{
// Note: NPTH pads are not drawn on copper layers when the pad
// has same shape as its hole
footprint->TransformPadsWithClearanceToPolygon( *layerPoly, curr_layer_id,
0, ARC_HIGH_DEF, ERROR_INSIDE,
true, renderPlatedPadsAsPlated,
false );
transformFPShapesToPolygon( footprint, curr_layer_id, *layerPoly );
}
}
if( renderPlatedPadsAsPlated )
{
// ADD PLATED PADS contours
for( FOOTPRINT* footprint : m_board->Footprints() )
{
footprint->TransformPadsWithClearanceToPolygon( *m_frontPlatedPadPolys, F_Cu,
0, ARC_HIGH_DEF, ERROR_INSIDE,
true, false, true );
footprint->TransformPadsWithClearanceToPolygon( *m_backPlatedPadPolys, B_Cu,
0, ARC_HIGH_DEF, ERROR_INSIDE,
true, false, true );
}
}
}
// Add graphic item on copper layers to object containers
for( PCB_LAYER_ID curr_layer_id : layer_id )
{
wxASSERT( m_layerMap.find( curr_layer_id ) != m_layerMap.end() );
BVH_CONTAINER_2D *layerContainer = m_layerMap[curr_layer_id];
// Add graphic items on copper layers (texts and other graphics)
for( BOARD_ITEM* item : m_board->Drawings() )
{
if( !item->IsOnLayer( curr_layer_id ) )
continue;
switch( item->Type() )
{
case PCB_SHAPE_T:
addShapeWithClearance( static_cast<PCB_SHAPE*>( item ), layerContainer,
curr_layer_id, 0 );
break;
case PCB_TEXT_T:
addShapeWithClearance( static_cast<PCB_TEXT*>( item ), layerContainer,
curr_layer_id, 0 );
break;
case PCB_DIM_ALIGNED_T:
case PCB_DIM_CENTER_T:
case PCB_DIM_RADIAL_T:
case PCB_DIM_ORTHOGONAL_T:
case PCB_DIM_LEADER_T:
addShapeWithClearance( static_cast<PCB_DIMENSION_BASE*>( item ),
layerContainer, curr_layer_id, 0 );
break;
default:
wxLogTrace( m_logTrace, wxT( "createLayers: item type: %d not implemented" ),
item->Type() );
break;
}
}
}
// Add graphic item on copper layers to poly contours (vertical outlines)
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL )
{
for( PCB_LAYER_ID cur_layer_id : layer_id )
{
wxASSERT( m_layers_poly.find( cur_layer_id ) != m_layers_poly.end() );
SHAPE_POLY_SET *layerPoly = m_layers_poly[cur_layer_id];
// Add graphic items on copper layers (texts and other )
for( BOARD_ITEM* item : m_board->Drawings() )
{
if( !item->IsOnLayer( cur_layer_id ) )
continue;
switch( item->Type() )
{
case PCB_SHAPE_T:
item->TransformShapeWithClearanceToPolygon( *layerPoly, cur_layer_id, 0,
ARC_HIGH_DEF, ERROR_INSIDE );
break;
case PCB_TEXT_T:
{
PCB_TEXT* text = static_cast<PCB_TEXT*>( item );
text->TransformTextShapeWithClearanceToPolygon( *layerPoly, cur_layer_id, 0,
ARC_HIGH_DEF, ERROR_INSIDE );
}
break;
default:
wxLogTrace( m_logTrace, wxT( "createLayers: item type: %d not implemented" ),
item->Type() );
break;
}
}
}
}
if( m_Cfg->m_Render.show_zones )
{
if( aStatusReporter )
aStatusReporter->Report( _( "Create zones" ) );
std::vector<std::pair<ZONE*, PCB_LAYER_ID>> zones;
std::unordered_map<PCB_LAYER_ID, std::unique_ptr<std::mutex>> layer_lock;
for( ZONE* zone : m_board->Zones() )
{
for( PCB_LAYER_ID layer : zone->GetLayerSet().Seq() )
{
zones.emplace_back( std::make_pair( zone, layer ) );
layer_lock.emplace( layer, std::make_unique<std::mutex>() );
}
}
// Add zones objects
std::atomic<size_t> nextZone( 0 );
std::atomic<size_t> threadsFinished( 0 );
size_t parallelThreadCount = std::min<size_t>( zones.size(),
std::max<size_t>( std::thread::hardware_concurrency(), 2 ) );
for( size_t ii = 0; ii < parallelThreadCount; ++ii )
{
std::thread t = std::thread( [&]()
{
for( size_t areaId = nextZone.fetch_add( 1 );
areaId < zones.size();
areaId = nextZone.fetch_add( 1 ) )
{
ZONE* zone = zones[areaId].first;
if( zone == nullptr )
break;
PCB_LAYER_ID layer = zones[areaId].second;
auto layerContainer = m_layerMap.find( layer );
auto layerPolyContainer = m_layers_poly.find( layer );
if( layerContainer != m_layerMap.end() )
{
addSolidAreasShapes( zone, layerContainer->second, layer );
}
if( m_Cfg->m_Render.opengl_copper_thickness
&& m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL
&& layerPolyContainer != m_layers_poly.end() )
{
auto mut_it = layer_lock.find( layer );
std::lock_guard< std::mutex > lock( *( mut_it->second ) );
zone->TransformSolidAreasShapesToPolygon( layer, *layerPolyContainer->second );
}
}
threadsFinished++;
} );
t.detach();
}
while( threadsFinished < parallelThreadCount )
std::this_thread::sleep_for( std::chrono::milliseconds( 10 ) );
}
// Simplify layer polygons
if( aStatusReporter )
aStatusReporter->Report( _( "Simplifying copper layers polygons" ) );
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL )
{
if( renderPlatedPadsAsPlated )
{
if( m_frontPlatedPadPolys && ( m_layers_poly.find( F_Cu ) != m_layers_poly.end() ) )
{
if( aStatusReporter )
aStatusReporter->Report( _( "Simplifying polygons on F_Cu" ) );
SHAPE_POLY_SET *layerPoly_F_Cu = m_layers_poly[F_Cu];
layerPoly_F_Cu->BooleanSubtract( *m_frontPlatedPadPolys, SHAPE_POLY_SET::PM_FAST );
m_frontPlatedPadPolys->Simplify( SHAPE_POLY_SET::PM_FAST );
}
if( m_backPlatedPadPolys && ( m_layers_poly.find( B_Cu ) != m_layers_poly.end() ) )
{
if( aStatusReporter )
aStatusReporter->Report( _( "Simplifying polygons on B_Cu" ) );
SHAPE_POLY_SET *layerPoly_B_Cu = m_layers_poly[B_Cu];
layerPoly_B_Cu->BooleanSubtract( *m_backPlatedPadPolys, SHAPE_POLY_SET::PM_FAST );
m_backPlatedPadPolys->Simplify( SHAPE_POLY_SET::PM_FAST );
}
}
std::vector< PCB_LAYER_ID > &selected_layer_id = layer_id;
std::vector< PCB_LAYER_ID > layer_id_without_F_and_B;
if( renderPlatedPadsAsPlated )
{
layer_id_without_F_and_B.clear();
layer_id_without_F_and_B.reserve( layer_id.size() );
for( size_t i = 0; i < layer_id.size(); ++i )
{
if( ( layer_id[i] != F_Cu ) && ( layer_id[i] != B_Cu ) )
layer_id_without_F_and_B.push_back( layer_id[i] );
}
selected_layer_id = layer_id_without_F_and_B;
}
if( selected_layer_id.size() > 0 )
{
if( aStatusReporter )
{
aStatusReporter->Report( wxString::Format( _( "Simplifying %d copper layers" ),
(int) selected_layer_id.size() ) );
}
std::atomic<size_t> nextItem( 0 );
std::atomic<size_t> threadsFinished( 0 );
size_t parallelThreadCount = std::min<size_t>(
std::max<size_t>( std::thread::hardware_concurrency(), 2 ),
selected_layer_id.size() );
for( size_t ii = 0; ii < parallelThreadCount; ++ii )
{
std::thread t = std::thread(
[&nextItem, &threadsFinished, &selected_layer_id, this]()
{
for( size_t i = nextItem.fetch_add( 1 );
i < selected_layer_id.size();
i = nextItem.fetch_add( 1 ) )
{
auto layerPoly = m_layers_poly.find( selected_layer_id[i] );
if( layerPoly != m_layers_poly.end() )
// This will make a union of all added contours
layerPoly->second->Simplify( SHAPE_POLY_SET::PM_FAST );
}
threadsFinished++;
} );
t.detach();
}
while( threadsFinished < parallelThreadCount )
std::this_thread::sleep_for( std::chrono::milliseconds( 10 ) );
}
}
// Simplify holes polygon contours
if( aStatusReporter )
aStatusReporter->Report( _( "Simplify holes contours" ) );
for( PCB_LAYER_ID layer : layer_id )
{
if( m_layerHoleOdPolys.find( layer ) != m_layerHoleOdPolys.end() )
{
// found
SHAPE_POLY_SET *polyLayer = m_layerHoleOdPolys[layer];
polyLayer->Simplify( SHAPE_POLY_SET::PM_FAST );
wxASSERT( m_layerHoleIdPolys.find( layer ) != m_layerHoleIdPolys.end() );
polyLayer = m_layerHoleIdPolys[layer];
polyLayer->Simplify( SHAPE_POLY_SET::PM_FAST );
}
}
// End Build Copper layers
// This will make a union of all added contours
m_throughHoleOdPolys.Simplify( SHAPE_POLY_SET::PM_FAST );
m_nonPlatedThroughHoleOdPolys.Simplify( SHAPE_POLY_SET::PM_FAST );
m_throughHoleViaOdPolys.Simplify( SHAPE_POLY_SET::PM_FAST );
m_throughHoleAnnularRingPolys.Simplify( SHAPE_POLY_SET::PM_FAST );
// Build Tech layers
// Based on:
// https://github.com/KiCad/kicad-source-mirror/blob/master/3d-viewer/3d_draw.cpp#L1059
if( aStatusReporter )
aStatusReporter->Report( _( "Build Tech layers" ) );
// draw graphic items, on technical layers
static const PCB_LAYER_ID teckLayerList[] = {
B_Adhes,
F_Adhes,
B_Paste,
F_Paste,
B_SilkS,
F_SilkS,
B_Mask,
F_Mask,
// Aux Layers
Dwgs_User,
Cmts_User,
Eco1_User,
Eco2_User,
Edge_Cuts,
Margin
};
// User layers are not drawn here, only technical layers
for( LSEQ seq = LSET::AllNonCuMask().Seq( teckLayerList, arrayDim( teckLayerList ) );
seq;
++seq )
{
const PCB_LAYER_ID curr_layer_id = *seq;
if( !Is3dLayerEnabled( curr_layer_id ) )
continue;
if( aStatusReporter )
aStatusReporter->Report( wxString::Format(
_( "Build Tech layer %d" ), (int)curr_layer_id ) );
BVH_CONTAINER_2D *layerContainer = new BVH_CONTAINER_2D;
m_layerMap[curr_layer_id] = layerContainer;
SHAPE_POLY_SET *layerPoly = new SHAPE_POLY_SET;
m_layers_poly[curr_layer_id] = layerPoly;
// Add drawing objects
for( BOARD_ITEM* item : m_board->Drawings() )
{
if( !item->IsOnLayer( curr_layer_id ) )
continue;
switch( item->Type() )
{
case PCB_SHAPE_T:
addShapeWithClearance( static_cast<PCB_SHAPE*>( item ), layerContainer,
curr_layer_id, 0 );
break;
case PCB_TEXT_T:
addShapeWithClearance( static_cast<PCB_TEXT*>( item ), layerContainer,
curr_layer_id, 0 );
break;
case PCB_DIM_ALIGNED_T:
case PCB_DIM_CENTER_T:
case PCB_DIM_RADIAL_T:
case PCB_DIM_ORTHOGONAL_T:
case PCB_DIM_LEADER_T:
addShapeWithClearance( static_cast<PCB_DIMENSION_BASE*>( item ), layerContainer,
curr_layer_id, 0 );
break;
default:
break;
}
}
// Add drawing contours
for( BOARD_ITEM* item : m_board->Drawings() )
{
if( !item->IsOnLayer( curr_layer_id ) )
continue;
switch( item->Type() )
{
case PCB_SHAPE_T:
item->TransformShapeWithClearanceToPolygon( *layerPoly, curr_layer_id, 0,
ARC_HIGH_DEF, ERROR_INSIDE );
break;
case PCB_TEXT_T:
{
PCB_TEXT* text = static_cast<PCB_TEXT*>( item );
text->TransformTextShapeWithClearanceToPolygon( *layerPoly, curr_layer_id, 0,
ARC_HIGH_DEF, ERROR_INSIDE );
}
break;
default:
break;
}
}
// Add footprints tech layers - objects
for( FOOTPRINT* footprint : m_board->Footprints() )
{
if( ( curr_layer_id == F_SilkS ) || ( curr_layer_id == B_SilkS ) )
{
int linewidth = m_board->GetDesignSettings().m_LineThickness[ LAYER_CLASS_SILK ];
for( PAD* pad : footprint->Pads() )
{
if( !pad->IsOnLayer( curr_layer_id ) )
continue;
buildPadOutlineAsSegments( pad, layerContainer, linewidth );
}
}
else
{
addPadsWithClearance( footprint, layerContainer, curr_layer_id, 0,
false, false, false );
}
addFootprintShapesWithClearance( footprint, layerContainer, curr_layer_id, 0 );
}
// Add footprints tech layers - contours
for( FOOTPRINT* footprint : m_board->Footprints() )
{
if( ( curr_layer_id == F_SilkS ) || ( curr_layer_id == B_SilkS ) )
{
int linewidth = m_board->GetDesignSettings().m_LineThickness[ LAYER_CLASS_SILK ];
for( PAD* pad : footprint->Pads() )
{
if( !pad->IsOnLayer( curr_layer_id ) )
continue;
buildPadOutlineAsPolygon( pad, *layerPoly, linewidth );
}
}
else
{
footprint->TransformPadsWithClearanceToPolygon( *layerPoly, curr_layer_id, 0,
ARC_HIGH_DEF, ERROR_INSIDE );
}
// On tech layers, use a poor circle approximation, only for texts (stroke font)
footprint->TransformFPTextWithClearanceToPolygonSet( *layerPoly, curr_layer_id, 0,
ARC_HIGH_DEF, ERROR_INSIDE );
// Add the remaining things with dynamic seg count for circles
transformFPShapesToPolygon( footprint, curr_layer_id, *layerPoly );
}
// Draw non copper zones
if( m_Cfg->m_Render.show_zones )
{
for( ZONE* zone : m_board->Zones() )
{
if( zone->IsOnLayer( curr_layer_id ) )
addSolidAreasShapes( zone, layerContainer, curr_layer_id );
}
for( ZONE* zone : m_board->Zones() )
{
if( zone->IsOnLayer( curr_layer_id ) )
zone->TransformSolidAreasShapesToPolygon( curr_layer_id, *layerPoly );
}
}
// This will make a union of all added contours
layerPoly->Simplify( SHAPE_POLY_SET::PM_FAST );
}
// End Build Tech layers
// Build BVH (Bounding volume hierarchy) for holes and vias
if( aStatusReporter )
aStatusReporter->Report( _( "Build BVH for holes and vias" ) );
m_throughHoleIds.BuildBVH();
m_throughHoleOds.BuildBVH();
m_throughHoleAnnularRings.BuildBVH();
if( !m_layerHoleMap.empty() )
{
for( auto& hole : m_layerHoleMap )
hole.second->BuildBVH();
}
// We only need the Solder mask to initialize the BVH
// because..?
if( m_layerMap[B_Mask] )
m_layerMap[B_Mask]->BuildBVH();
if( m_layerMap[F_Mask] )
m_layerMap[F_Mask]->BuildBVH();
}
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