pcbs/debugconn/gerber/debugconn-job.gbrjob

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{
"Header":
{
"GenerationSoftware":
{
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "5.1.10"
},
"CreationDate": "2021-08-08T15:42:29+02:00"
},
"GeneralSpecs":
{
"ProjectId":
{
"Name": "debugconn",
"GUID": "64656275-6763-46f6-9e6e-2e6b69636164",
"Revision": "rev?"
},
"Size":
{
"X": 16.914,
"Y": 37.742
},
"LayerNumber": 2,
"BoardThickness": 1.600
},
"DesignRules":
[
{
"Layers": "Outer",
"PadToPad": 0.200,
"PadToTrack": 0.200,
"TrackToTrack": 0.200,
"MinLineWidth": 0.250,
"TrackToRegion": 0.508,
"RegionToRegion": 0.508
}
],
"FilesAttributes":
[
{
"Path": "debugconn-F_Cu.gbr",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "debugconn-B_Cu.gbr",
"FileFunction": "Copper,L2,Bot",
"FilePolarity": "Positive"
},
{
"Path": "debugconn-F_Paste.gbr",
"FileFunction": "SolderPaste,Top",
"FilePolarity": "Positive"
},
{
"Path": "debugconn-B_Paste.gbr",
"FileFunction": "SolderPaste,Bot",
"FilePolarity": "Positive"
},
{
"Path": "debugconn-F_SilkS.gbr",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "debugconn-B_SilkS.gbr",
"FileFunction": "Legend,Bot",
"FilePolarity": "Positive"
},
{
"Path": "debugconn-F_Mask.gbr",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "debugconn-B_Mask.gbr",
"FileFunction": "SolderMask,Bot",
"FilePolarity": "Negative"
},
{
"Path": "debugconn-Edge_Cuts.gbr",
"FileFunction": "Profile",
"FilePolarity": "Positive"
}
],
"MaterialStackup":
[
{
"Type": "Legend",
"Notes": "Layer F.SilkS"
},
{
"Type": "SolderPaste",
"Notes": "Layer F.Paste"
},
{
"Type": "SolderMask",
"Notes": "Layer F.Mask"
},
{
"Type": "Copper",
"Notes": "Layer F.Cu"
},
{
"Type": "Dielectric",
"Material": "FR4",
"Notes": "Layers L1/L2"
},
{
"Type": "Copper",
"Notes": "Layer B.Cu"
},
{
"Type": "SolderMask",
"Notes": "Layer B.Mask"
},
{
"Type": "SolderPaste",
"Notes": "Layer B.Paste"
},
{
"Type": "Legend",
"Notes": "Layer B.SilkS"
}
]
}