Modify some low-quality translations
This commit is contained in:
Liu Guang
Marco Ciampa
parent
c0c9af28f1
commit
34d80c8ca9
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@ -3,7 +3,7 @@ msgstr ""
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"Project-Id-Version: KICAD\n"
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"Report-Msgid-Bugs-To: \n"
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"POT-Creation-Date: 2018-06-05 16:03+0200\n"
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"PO-Revision-Date: 2018-06-13 17:45+0800\n"
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"PO-Revision-Date: 2018-06-15 13:40+0800\n"
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"Last-Translator: Liu Guang <l.g110@163.com>\n"
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"Language-Team: \n"
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"Language: zh_CN\n"
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@ -1073,7 +1073,7 @@ msgstr "电路板颜色"
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#: 3d-viewer/3d_viewer/eda_3d_viewer.cpp:1171
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msgid "Solder Paste Color"
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msgstr "助焊层颜色"
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msgstr "层颜色"
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#: 3d-viewer/3d_viewer/hotkeys.cpp:34 eeschema/hotkeys.cpp:118
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#: gerbview/hotkeys.cpp:68 kicad/menubar.cpp:161
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@ -12222,11 +12222,11 @@ msgstr "顶层丝印层 (*.GTO)|*.GTO;*.gto|"
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#: gerbview/files.cpp:176
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msgid "Bottom paste (*.GBP)|*.GBP;*.gbp|"
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msgstr "底层助焊层 (*.GBP)|*.GBP;*.gbp|"
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msgstr "底层锡膏 (*.GBP)|*.GBP;*.gbp|"
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#: gerbview/files.cpp:177
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msgid "Top paste (*.GTP)|*.GTP;*.gtp|"
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msgstr "顶层助焊层 (*.GTP)|*.GTP;*.gtp|"
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msgstr "顶层锡膏 (*.GTP)|*.GTP;*.gtp|"
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#: gerbview/files.cpp:178
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msgid "Keep-out layer (*.GKO)|*.GKO;*.gko|"
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@ -13521,7 +13521,7 @@ msgstr "编辑页面布局"
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#: kicad/menubar.cpp:432
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msgid "Pl editor - Worksheet layout editor"
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msgstr "Pl 编辑器 - 图框编辑器"
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msgstr "Pl 编辑器 - 工作表布局编辑器"
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#: kicad/menubar.cpp:440
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msgid "KiCad &Manual"
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@ -14165,7 +14165,7 @@ msgstr "没有选中的文件"
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#: pagelayout_editor/pl_editor_frame.cpp:444
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#, c-format
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msgid "Page size: width %.4g height %.4g"
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msgstr "页面尺寸: 宽 %.4g 高t %.4g"
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msgstr "页面尺寸: 宽 %.4g 高 %.4g"
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#: pagelayout_editor/pl_editor_frame.cpp:489
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#, c-format
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@ -14217,16 +14217,16 @@ msgid ""
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"Show title block like it will be displayed in applications\n"
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"texts with format are replaced by the full text"
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msgstr ""
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"标题块的显示与实际显示在应用程序一样\n"
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"文本格式被替换全部文字"
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"标题栏的显示与实际显示在应用程序一样\n"
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"文本格式被完整的文本所取代"
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#: pagelayout_editor/toolbars_pl_editor.cpp:109
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msgid ""
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"Show title block in edit mode: texts are shown as is:\n"
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"texts with format are displayed with no change"
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msgstr ""
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"编辑模式显示标题栏：文本显示为：\n"
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"通用格式符号显示，实际显示的内容不会改变"
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"在编辑模式下显示标题栏：文本显示为：\n"
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"文本格式显示不变"
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#: pagelayout_editor/toolbars_pl_editor.cpp:117
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msgid "Left Top paper corner"
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@ -15096,8 +15096,8 @@ msgid ""
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"will be calculated. The width for the other trace to also handle this "
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"current will then be calculated."
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msgstr ""
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"如果指定了一个布线宽度, 则计算它可以通过的最大电流。然后, 再计算另一个布线通"
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"过此电流的最小线宽。"
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"如果指定了外层（或内层）布线宽度, 则计算它可以通过的最大电流。然后, 再计算内"
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"层（或外层）布线通过此电流的最小线宽。"
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#: pcb_calculator/tracks_width_versus_current.cpp:455
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msgid "The controlling value is shown in bold."
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@ -17408,7 +17408,7 @@ msgstr "显示焊盘无网络连接指示"
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#: pcbnew/dialogs/dialog_display_options_base.cpp:53
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msgid "Clearance Outlines:"
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msgstr "间距概要："
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msgstr "间隙概要："
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#: pcbnew/dialogs/dialog_display_options_base.cpp:55
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#: pcbnew/dialogs/dialog_general_options_BoardEditor_base.cpp:182
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@ -17422,7 +17422,7 @@ msgstr "新布线"
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#: pcbnew/dialogs/dialog_display_options_base.cpp:55
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msgid "New track with via area"
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msgstr "在过孔区域新布线"
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msgstr "过孔区域的新布线"
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#: pcbnew/dialogs/dialog_display_options_base.cpp:55
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msgid "New and edited tracks with via area"
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@ -17824,7 +17824,7 @@ msgstr "正间隙指的是比焊盘大的区域（通常为阻焊）"
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#: pcbnew/dialogs/dialog_edit_footprint_for_fp_editor_base.cpp:188
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msgid ""
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"Negative clearance means area smaller than the pad (usual for solder paste)."
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msgstr "负间隙指的是比焊盘小的区域（通常为助焊）"
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msgstr "负间隙指的是比焊盘小的区域（通常为锡膏）"
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#: pcbnew/dialogs/dialog_edit_footprint_for_BoardEditor_base.cpp:253
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#: pcbnew/dialogs/dialog_edit_footprint_for_fp_editor_base.cpp:197
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@ -17866,7 +17866,7 @@ msgstr ""
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#: pcbnew/dialogs/dialog_mask_clearance_base.cpp:81
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#: pcbnew/dialogs/dialog_pad_properties_base.cpp:457
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msgid "Solder paste clearance:"
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msgstr "助焊间隙:"
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msgstr "锡膏间隙:"
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#: pcbnew/dialogs/dialog_edit_footprint_for_BoardEditor_base.cpp:283
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#: pcbnew/dialogs/dialog_edit_footprint_for_fp_editor_base.cpp:227
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@ -17878,16 +17878,18 @@ msgid ""
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"ratio\n"
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"A negative value means a smaller mask size than pad size"
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msgstr ""
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"这是该焊盘的助焊和焊盘的局部间距值设置\n"
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"该值可以由一个焊盘局部值所取代。\n"
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"最终的间距值是该值的总和，间距比值负值意味着更小的掩模尺寸更大的焊盘尺寸"
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"这是焊盘和焊膏之间的局部间隙\n"
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"对于这个封装。\n"
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"该值可以被一个焊盘局部值代替。\n"
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"最终间隙值是此值与间隙值比率的总和\n"
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"负值表示比焊盘尺寸更小的阻焊尺寸"
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#: pcbnew/dialogs/dialog_edit_footprint_for_BoardEditor_base.cpp:294
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#: pcbnew/dialogs/dialog_edit_footprint_for_fp_editor_base.cpp:238
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#: pcbnew/dialogs/dialog_mask_clearance_base.cpp:94
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#: pcbnew/dialogs/dialog_pad_properties_base.cpp:470
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msgid "Solder paste ratio clearance:"
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msgstr "助焊间隙比例:"
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msgstr "锡膏间隙比例:"
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#: pcbnew/dialogs/dialog_edit_footprint_for_BoardEditor_base.cpp:296
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#: pcbnew/dialogs/dialog_edit_footprint_for_fp_editor_base.cpp:240
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@ -17900,7 +17902,7 @@ msgid ""
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"The final clearance value is the sum of this value and the clearance value\n"
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"A negative value means a smaller mask size than pad size."
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msgstr ""
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"这是在每个焊盘与助焊这个封装之间的局部间隙百分比。\n"
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"这是在每个焊盘与这个封装之间的局部间隙百分比。\n"
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"10的值表示间隙值是焊盘尺寸的百分之十\n"
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"这个值可以由一个焊盘局部值所取代。\n"
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"最终的间隙值是这个值之和的间隙值\n"
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@ -17912,7 +17914,7 @@ msgstr ""
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#: pcbnew/dialogs/dialog_pad_properties_base.cpp:514
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msgid ""
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"Note: solder mask and paste values are used only for pads on copper layers."
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msgstr "注意：阻焊和助焊值仅适用于铜层上的焊盘。"
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msgstr "注意：阻焊和锡膏值仅适用于铜层上的焊盘。"
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#: pcbnew/dialogs/dialog_edit_footprint_for_BoardEditor_base.cpp:333
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msgid "3D Shape Name:"
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@ -19683,11 +19685,11 @@ msgstr "电路板上, 非铜层"
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#: pcbnew/dialogs/dialog_layers_setup_base.cpp:199
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msgid "SoldP_Front_later"
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msgstr "顶层助焊"
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msgstr "顶层"
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#: pcbnew/dialogs/dialog_layers_setup_base.cpp:210
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msgid "If you want a solder paster layer for front side of the board"
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msgstr "开启/关闭 顶层助焊层"
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msgstr "开启/关闭 顶层层"
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#: pcbnew/dialogs/dialog_layers_setup_base.cpp:224
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msgid "SilkS_Front_later"
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@ -20040,11 +20042,11 @@ msgstr "开启/关闭 底层丝印层"
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#: pcbnew/dialogs/dialog_layers_setup_base.cpp:1482
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msgid "SoldP_Back_later"
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msgstr "底层助焊"
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msgstr "底层"
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#: pcbnew/dialogs/dialog_layers_setup_base.cpp:1493
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msgid "If you want a solder paste layer for the back side of the board"
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msgstr "开启/关闭 底层助焊层"
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msgstr "如果你想在电路板底层使用锡膏层"
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#: pcbnew/dialogs/dialog_layers_setup_base.cpp:1507
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msgid "Adhes_Back_later"
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@ -20172,7 +20174,7 @@ msgid ""
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"The final clearance value is the sum of this value and the clearance value "
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"ratio"
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msgstr ""
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"这是该焊盘的助焊和焊盘的局部间距值设置\n"
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"这是该焊盘的和焊盘的局部间距值设置\n"
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"该值可以由一个焊盘局部值所取代。\n"
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"最终的间距值是该值的总和，间距比值负值意味着更小的掩模尺寸更大的焊盘尺寸"
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@ -20728,7 +20730,7 @@ msgid ""
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"Error: Connector pads are not on the solder paste layer\n"
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"Use SMD pads instead"
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msgstr ""
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"错误: 焊盘连接不是在助焊层\n"
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"错误: 焊盘连接不是在锡膏层\n"
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"使用 SMD 焊盘替代"
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#: pcbnew/dialogs/dialog_pad_properties.cpp:1214
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@ -20966,11 +20968,11 @@ msgstr "粘胶底层"
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#: pcbnew/dialogs/dialog_pad_properties_base.cpp:358
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msgid "Front solder paste"
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msgstr "顶层助焊"
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msgstr "顶层锡膏"
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#: pcbnew/dialogs/dialog_pad_properties_base.cpp:361
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msgid "Back solder paste"
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msgstr "底层助焊"
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msgstr "底层锡膏"
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#: pcbnew/dialogs/dialog_pad_properties_base.cpp:367
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msgid "Back silk screen"
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@ -21005,7 +21007,7 @@ msgstr "正间隙指的是比焊盘大的区域（通常为阻焊间隙）"
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msgid ""
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"Negative clearance means area smaller than the pad (usual for paste "
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"clearance)."
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msgstr "负间隙指的是比焊盘小的区域（通常为助焊间隙）"
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msgstr "负间隙指的是比焊盘小的区域（通常为锡膏间隙）"
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#: pcbnew/dialogs/dialog_pad_properties_base.cpp:423
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msgid "Clearances"
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@ -21039,7 +21041,7 @@ msgid ""
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"ratio\n"
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"A negative value means a smaller mask size than pad size"
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msgstr ""
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"这是该焊盘和助焊之间的局部间隙.\n"
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"这是该焊盘和之间的局部间隙.\n"
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"如果为0的封装值或使用全局值.\n"
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"最终间隙值是该值的总和\n"
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"负值意味着掩模尺寸更小比焊盘尺寸"
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@ -21053,7 +21055,7 @@ msgid ""
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"The final clearance value is the sum of this value and the clearance value\n"
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"A negative value means a smaller mask size than pad size."
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msgstr ""
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"这是根据该焊盘和助焊的局部间隙百分比。\n"
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"这是根据该焊盘和的局部间隙百分比。\n"
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"10的值表示间隙值是焊盘尺寸的百分之十\n"
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"如果为0该封装值或者全局值将在网络类使用.\n"
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"最终间隙的值是该值和间隙值的总和。\n"
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@ -23376,7 +23378,7 @@ msgstr " \"%s\" 无法转换为整数"
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#: pcbnew/gpcb_plugin.cpp:248 pcbnew/gpcb_plugin.cpp:926
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#, c-format
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msgid "footprint library path \"%s\" does not exist"
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msgstr "封装库路径 '%s' 不存在"
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msgstr "封装库路径 \"%s\" 不存在"
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#: pcbnew/gpcb_plugin.cpp:304 pcbnew/kicad_plugin.cpp:329
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#, c-format
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@ -23785,7 +23787,7 @@ msgstr "无法重命名临时文件 '%s' 到封装库文件 '%s'"
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#: pcbnew/kicad_plugin.cpp:266
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#, c-format
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msgid "Footprint library path \"%s\" does not exist"
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msgstr "封装库路径 '%s' 不存在"
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msgstr "封装库路径 \"%s\" 不存在"
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#: pcbnew/kicad_plugin.cpp:1294 pcbnew/legacy_plugin.cpp:96
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#, c-format
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@ -25702,11 +25704,11 @@ msgstr "底层粘胶"
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#: pcbnew/pcb_layer_widget.cpp:539
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msgid "Solder paste on board's front"
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msgstr "顶层助焊"
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msgstr "顶层锡膏"
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#: pcbnew/pcb_layer_widget.cpp:540
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msgid "Solder paste on board's back"
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msgstr "底层助焊"
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msgstr "底层锡膏"
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#: pcbnew/pcb_layer_widget.cpp:541
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msgid "Silkscreen on board's front"
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