haskal
/
kicad
1
0
Fork 0
Code Issues Pull Requests Packages Projects Releases Wiki Activity

QFNWizard: ensure thermal vias/pads have the property PAD_PROP::HEATSINK set.

This commit is contained in:
jean-pierre charras 2024-01-11 16:29:41 +01:00
parent 0ac23f9099
commit 549ef88f70
1 changed files with 2 additions and 0 deletions
Show Stats Download Patch File Download Diff File Expand all files Collapse all files

2
pcbnew/python/plugins/qfn_wizard.py
View File

@ -178,6 +178,8 @@ class QFNWizard(FootprintWizardBase.FootprintWizard):
via_diam = min(aper_pad_w, aper_pad_l) / 2 via_diam = min(aper_pad_w, aper_pad_l) / 2
via_drill = min(via_diam / 2, epad_via_drill) via_drill = min(via_diam / 2, epad_via_drill)
via = PA.PadMaker(self.module).THRoundPad(via_diam, via_drill) via = PA.PadMaker(self.module).THRoundPad(via_diam, via_drill)
# A thermal via must have the PAD_PROP_HEATSINK set.
via.SetProperty( pcbnew.PAD_PROP_HEATSINK )
layers = pcbnew.LSET.AllCuMask() layers = pcbnew.LSET.AllCuMask()
layers.AddLayer(pcbnew.B_Mask) layers.AddLayer(pcbnew.B_Mask)
layers.AddLayer(pcbnew.F_Mask) layers.AddLayer(pcbnew.F_Mask)