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QFNWizard: ensure thermal vias/pads have the property PAD_PROP::HEATSINK set.

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jean-pierre charras 2024-01-11 16:29:41 +01:00
parent 0ac23f9099
commit 549ef88f70
1 changed files with 2 additions and 0 deletions
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2
pcbnew/python/plugins/qfn_wizard.py
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@ -178,6 +178,8 @@ class QFNWizard(FootprintWizardBase.FootprintWizard):
via_diam = min(aper_pad_w, aper_pad_l) / 2
via_drill = min(via_diam / 2, epad_via_drill)
via = PA.PadMaker(self.module).THRoundPad(via_diam, via_drill)
# A thermal via must have the PAD_PROP_HEATSINK set.
via.SetProperty( pcbnew.PAD_PROP_HEATSINK )
layers = pcbnew.LSET.AllCuMask()
layers.AddLayer(pcbnew.B_Mask)
layers.AddLayer(pcbnew.F_Mask)