Indentation was completely broken (editor tabbing issue, maybe?)
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@ -50,14 +50,14 @@
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* Useful because 356A (when implemented) must be sorted before outputting it */
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struct D356_RECORD
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{
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bool smd;
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bool hole;
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wxString netname;
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wxString refdes;
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wxString pin;
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bool midpoint;
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bool smd;
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bool hole;
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wxString netname;
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wxString refdes;
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wxString pin;
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bool midpoint;
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int drill;
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bool mechanical;
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bool mechanical;
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int access; // Access 0 is 'both sides'
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int soldermask;
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// All these in PCB units, will be output in decimils
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@ -74,19 +74,19 @@ static int compute_pad_access_code( BOARD *aPcb, LAYER_MSK aLayerMask )
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// Non-copper is not interesting here
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aLayerMask &= ALL_CU_LAYERS;
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if( aLayerMask == 0 )
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return -1;
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return -1;
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// Traditional TH pad
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if( (aLayerMask & LAYER_FRONT) && (aLayerMask & LAYER_BACK) )
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return 0;
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return 0;
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// Front SMD pad
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if( (aLayerMask & LAYER_FRONT) )
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return 1;
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return 1;
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// Back SMD pad
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if( (aLayerMask & LAYER_BACK) )
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return aPcb->GetCopperLayerCount();
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return aPcb->GetCopperLayerCount();
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// OK, we have an inner-layer only pad (and I have no idea about
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// what could be used for); anyway, find the first copper layer
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@ -129,36 +129,36 @@ static void build_pad_testpoints( BOARD *aPcb,
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// It could be a mask only pad, we only handle pads with copper here
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if( rk.access != -1 )
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{
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rk.netname = pad->GetNetname();
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rk.refdes = module->GetReference();
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pad->StringPadName( rk.pin );
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rk.midpoint = false; // XXX MAYBE need to be computed (how?)
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const wxSize& drill = pad->GetDrillSize();
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rk.drill = std::min( drill.x, drill.y );
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rk.hole = (rk.drill != 0);
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rk.smd = pad->GetAttribute() == PAD_SMD;
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rk.mechanical = (pad->GetAttribute() == PAD_HOLE_NOT_PLATED);
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rk.x_location = pad->GetPosition().x - origin.x;
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rk.y_location = origin.y - pad->GetPosition().y;
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rk.x_size = pad->GetSize().x;
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rk.netname = pad->GetNetname();
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rk.refdes = module->GetReference();
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pad->StringPadName( rk.pin );
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rk.midpoint = false; // XXX MAYBE need to be computed (how?)
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const wxSize& drill = pad->GetDrillSize();
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rk.drill = std::min( drill.x, drill.y );
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rk.hole = (rk.drill != 0);
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rk.smd = pad->GetAttribute() == PAD_SMD;
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rk.mechanical = (pad->GetAttribute() == PAD_HOLE_NOT_PLATED);
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rk.x_location = pad->GetPosition().x - origin.x;
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rk.y_location = origin.y - pad->GetPosition().y;
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rk.x_size = pad->GetSize().x;
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// Rule: round pads have y = 0
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if( pad->GetShape() == PAD_CIRCLE )
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rk.y_size = 0;
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else
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rk.y_size = pad->GetSize().y;
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// Rule: round pads have y = 0
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if( pad->GetShape() == PAD_CIRCLE )
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rk.y_size = 0;
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else
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rk.y_size = pad->GetSize().y;
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rk.rotation = -KiROUND( pad->GetOrientation() ) / 10;
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if( rk.rotation < 0 ) rk.rotation += 360;
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rk.rotation = -KiROUND( pad->GetOrientation() ) / 10;
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if( rk.rotation < 0 ) rk.rotation += 360;
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// the value indicates which sides are *not* accessible
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rk.soldermask = 3;
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if( pad->GetLayerMask() & SOLDERMASK_LAYER_FRONT)
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rk.soldermask &= ~1;
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if( pad->GetLayerMask() & SOLDERMASK_LAYER_BACK)
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rk.soldermask &= ~2;
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// the value indicates which sides are *not* accessible
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rk.soldermask = 3;
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if( pad->GetLayerMask() & SOLDERMASK_LAYER_FRONT)
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rk.soldermask &= ~1;
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if( pad->GetLayerMask() & SOLDERMASK_LAYER_BACK)
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rk.soldermask &= ~2;
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aRecords.push_back( rk );
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aRecords.push_back( rk );
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}
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}
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}
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@ -172,15 +172,15 @@ static int via_access_code( BOARD *aPcb, int top_layer, int bottom_layer )
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// Easy case for through vias: top_layer is component, bottom_layer is
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// solder, access code is 0
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if( (top_layer == LAYER_N_FRONT) && (bottom_layer == LAYER_N_BACK) )
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return 0;
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return 0;
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// Blind via, reachable from front
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if( top_layer == LAYER_N_FRONT )
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return 1;
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return 1;
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// Blind via, reachable from bottom
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if( bottom_layer == LAYER_N_BACK )
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return aPcb->GetCopperLayerCount();
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return aPcb->GetCopperLayerCount();
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// It's a buried via, accessible from some inner layer
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// (maybe could be used for testing before laminating? no idea)
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