bitmaps.h was included in nearly every file in the project due to it
being included by base_struct.h
Only about 130 files actually use the XPM definitions defined there, and
many of those already included bitmaps.h themselves, or via
menu_helpers.h. However, touching bitmaps.h would result in over 400
rebuilt files for pcbnew alone.
This commit moves the bitmap-related types like BITMAT_DEF out to a new
header, which is still included by base_struct.h, which is less
avoidable for now, it's it's used in the interface.
The icon list is still in bitmaps.h. This has the side effect that's
it's now easier to automatically generate this file.
Many classes in pcbnew and eeschema needed some functions moved
to the implementaitons from the headers too.
Make all EDA_TEXT data private and rename accessors to avoid function
name collisions in derived classes.
Overload EDA_TEXT's SetTextAngle() and SetEffects() in TEXTE_PCB.
Add support for preserving Reference text position, size, orientation
during a netlist import into a BOARD, as well as the one off footprint
update dialog.
Some accessors should be const:
* IsFlipped
* GetRoundRectRadiusRatio
Returning a objects by value as const in these cases is not helpful, as
all it does is prevent the caller moving from the return value, it just
forces a copy.
Some of thse functions come from base class overrides, those haven't
been changed.
* ShapePos
* GetPadName
* GetPackedPadName
It should help if (or when) the internal angle unit used in kicad will be changed from 0.1 degree (a relic of code written for PCs without fpu) to degree ( a more natural unit).
2. Whole bunch of pointless casts removed
3. Unused variables removed
4. Fix bug caused by JP on April 25, 2015 where strings were adjusted for translation and the hotkeys section table accidentally swapped the footprint editor title with tag, resulting in "footprint editor" being exported instead of "[footprinteditor]"
No functional changes besides #4, technically it'll "break" imports hotkeys files but April 25 broke imports as well.
PAD_SHAPE_T and PAD_ATTR_T still have a double definition (new names and old names) to be sure python scripts are nor broken by the change.
PAD_DRILL_SHAPE_T does not have a double definition, because it is unlikely oblong holes are used in python scripts.
Double definitions will be removed in the (next) future.
* Cleanup namespace in enum ZoneConnection in pcbnew/zones.h to self-explained names unification: PAD_ZONE_CONN_INHERITED, PAD_ZONE_CONN_NONE,PAD_ZONE_CONN_THERMAL,PAD_ZONE_CONN_FULL, PAD_ZONE_CONN_THT_THERMAL
* Make title capitalization consistant.
* Replace some instances of module with footprint.
* Use angle instead of orientation where appropriate.
* Remove abbreviations where it made sense.
* Coding policy fixes.
2) PNS router incorrectly detects collisions with blind/buried vias that don't actually intersect the active layer
3) PNS router silently converts blind/buried vias to through-board vias when shoved
The default layer stack between these 2 types was swaped in pad definition, and also in the dialog pad properties.
This double swap creates no bug, but creates bugs in the footprint wizards (SMD or CONN pads do not have the right layer stack)
FYI, the CONN pad type should be removed soon.
2) Change from legacy Cu stack to counting down from top=(F_Cu or 0).
The old Cu stack required knowing the count of Cu layers to make
sense of the layer number when converting to many exported file types.
The new Cu stack is more commonly used, although ours still gives
B_Cu a fixed number.
3) Introduce class LSET and enum LAYER_ID.
4) Change *.kicad_pcb file format version to 4 from 3.
5) Change fixed names Inner1_Cu-Inner14_Cu to In1_Cu-In30_Cu and their
meanings are typically flipped.
6) Moved the #define LAYER_N_* stuff into legacy_plugin.cpp where they
can die a quiet death, and switch to enum LAYER_ID symbols throughout.
7) Removed the LEGACY_PLUGIN::Save() and FootprintSave() functions.
You will need to convert to the format immediately, *.kicad_pcb and
*.kicad_mod (=pretty) since legacy format was never going to know
about 32 Cu layers and additional technical layers and the reversed Cu
stack.