* Fix a bug when full file name and path are passed to FOOTPRINT_INFO::
ReadFootprintFiles() which I created in bug fix lp:593989.
* Fix a wxString debug assertion in EDA_APP::InitEDA_Appl() when the KICAD
environment variable is defined as an empty string.
* Add error dialog when libraries cannot be found in system search path
when loading footprint using the select footprint dialog.
* Add footprint library name column to the EDA_LIST_DIALOG when selecting
footprints from the list.
* Allow reading all columns from the selected row in EDA_LIST_DIALOG.
* Remove redundant sort from EDA_LIST_DIALOG constructor
* Add library name member variable and accessors to FOOTPRINT_INFO.
* Make headers translatable for Eeschema select component from list dialog.
* Add some helper methods to FPID for identifying the FPID type and validity.
* Remove a bunch of trailing whitespace and add missing license comments.
(explanation: float is implicitly promoted to double anyway, it's only useful
for storage; also a fp variable forces conversion of other int in the expression
without needing a cast)
Typo fixes in some comments 'floatting' -> 'floating' :D
The plan goes like this:
- eeschema still uses int in decidegrees
- all the other things internally use double in decidegrees (or radians
in temporaries)
- in pcbnew UI the unit is *still* int in decidegrees
The idea is to have better precision everywhere while keeping the user with int i
angles. Hopefully, if a fractional angle doesn't come in from the outside, everything
should *look* like an integer angle (unless I forgot something and it broke)
When the time comes, simply updating the UI for allowing doubles from the user should
be enough to get arbitrary angles in pcbnew.
Adds "kicad_pcb" to the list of file-extensions for PCBnew in its Info.plist
to make Launch Services recognize the file associations.
Change 8 bit string to UTF8 so fancy mew in "um" can be shown.
* All items shapes are converted to polygons.
* Polygons are merged layer by layer (for calculation time reasons,zones are not merged)
* for copper layers, vias and pads holes are substracted from polygons (but, for calculation time reasons, not inside zones areas).
* the look is better, mainly when displaying the copper thickness
* solder and paste layers are now shown in 3D viewer.
* the code was seriously cleaned (but still needs to be enhanced).
* Note this is a work in progress which needs refinements.
* All items shapes are converted to polygons.
* Polygons are merged layer by layer (for calculation time reasons,zones are not merged)
* for copper layers, vias and pads holes are substracted from polygons (but, for calculation time reasons, not inside zones areas).
* the look is better, mainly when displaying the copper thickness
* solder and paste layers are now shown in 3D viewer.
* the code was seriously cleaned (but still needs to be enhanced).
* Note this is a work in progress which needs refinements.
- Removed spurious int casts (these are truncated anyway and will break
doubles)
- Applied the Distance, GetLineLength, EuclideanNorm, DEG2RAD, RAD2DEG
ArcTangente and NORMALIZE* functions where possible
- ArcTangente now returns double and handles the 0,0 case like atan2, so
it's no longer necessary to check for it before calling
- Small functions in trigo moved as inline
Interior regions on Edge.Cuts are out as keepouts for specctra DSN file
and downstream routers. Point to point matching during polygon assembly
can have individual thresholds, one for board edge and another for interior polygons.
This is more forgiving for sloppy graphical mousers, or those that work without
grid snap on. Currently the threshold for board edge is at zero, meaning the
board edge has to be precisely defined as a polygon, just as before. But it
is easily tunable for experimentation.
Dick Hollenbeck
Maciej Suminski
jean-pierre charras
Wayne Stambaugh
Lorenzo Marcantonio
Felix Morgner
Dr. Thomas Spindler