ADDED zone_connection constraint.
ADDED thermal_relief_gap and thermal_spoke_width constraints.
ADDED angle override for thermal relief spokes in Pad Properties.
Fixes https://gitlab.com/kicad/code/kicad/issues/4067
CHANGED: manually-placed (stitching) vias won't have their nets automatically updated
(unless the via is placed directly on a track segment)
CHANGED: stitching vias can be placed on footprint pads and pick up their nets
Fixes https://gitlab.com/kicad/code/kicad/-/issues/5484
This allows the parser to properly interpret the sexpr version
of the footprint so that it can throw future format errors or
do version specific parsing properly.
Previously the fill for shapes inside a footprint was not being
properly imported from older versions becase the default of no
flag changed from representing filled to representing no fill.
Introduce explicit filling information, and continue to treat no
flag on a polygon as meaning it is filled (which is the legacy
behavior).
Fixes https://gitlab.com/kicad/code/kicad/-/issues/6393
Fixes https://gitlab.com/kicad/code/kicad/-/issues/6390
This is a board file format change to account for the new properties.
Also, we now only store the critical information about the dimension's
geometry in the board, rather than storing every drawn line.
The DIMENSION object is now an abstract base, and ALIGNED_DIMENSION
is the implementation that exists today (we will add more dimension
types in the future)
This option removes copper layers from pads and vias where they are not
connected to other board elements. This allows the inner layers to be
more closely routed if the via landing pad is not needed.
Fixes https://gitlab.com/kicad/code/kicad/issues/1835
It's currently only supported in the Footprint Editor. It could be
easily added to the board editor (all the code is there), but the board
editor is a little short on room in the drawing tools toolbar.
Property is a pad info used mainly for fabrication or test.
Currently, supported properties are:
BGA property (variant of SMD pad)
Fiducial (global to the board or local to the footprint)
Test Point
Heat sink
Castellated.
And are used in Gerber files (copper layers and drill files)
Increment BOARD_FILE_VERSION to 20200104
The pin name defined in Eeschema is now available as pad info.
Useful for the board designer (the pin function is displayed in the message panel).
Needed for the Gerber P&P files.
This places the arc approximation setting in the kicad_pcb file and uses
it for all parts of the board rendering where arcs are converted to
segments. This allows the user to customize their speed vs. accuracy
tradeoff. The default setting of maximum error of 0.005mm is acceptable
for small boards on moderate systems.
the filled areas can use a hatch pattern (crossing lines) using square holes.
The zone filler removes too small holes (truncated holes) from hatch pattern.
It avoid to create small holes when a hole pattern is truncated by the filled area base shape.
Allows 0 to 4 chamfered corners, not only one.
A custom shape allow this kind of shape. However because it is a primitive,
it is easier to edit and it support thermal reliefs.
* Use FPID instead of wxString in MODULE object.
* Use FPID instead of wxString when loading and saving files.
* Use FPID in COMPONENT object.
* Add wxString helper functions and comparison operators to FPID.
* Add fp_lib token to pcb and netlist file formats.
* Add code to load and save FPIDs to pcb file format.
* Fix segfault when deleting invalid footprint library tables in Pcbnew
in non footprint library table build.
* Fix bug when counting the number of mod files in
EDA_APP::SetFootprintLibTablePath();
Jeff Young
Jon Evans
Ian McInerney
Joshua Redstone
Seth Hillbrand
jean-pierre charras
Seth Hillbrand
Chris Pavlina
Tomasz Wlostowski
Wayne Stambaugh