Translated using Weblate (Chinese (Simplified))
Currently translated at 100.0% (8011 of 8011 strings) Translation: KiCad EDA/v7 Translate-URL: https://hosted.weblate.org/projects/kicad/v7/zh_Hans/
This commit is contained in:
parent
267cfdf54b
commit
defcfc2962
|
@ -25,16 +25,16 @@ msgstr ""
|
|||
"Project-Id-Version: KiCad_zh_CN_Master_v0.0.32\n"
|
||||
"Report-Msgid-Bugs-To: \n"
|
||||
"POT-Creation-Date: 2023-02-10 15:35-0800\n"
|
||||
"PO-Revision-Date: 2023-02-06 07:25+0000\n"
|
||||
"Last-Translator: taotieren <admin@taotieren.com>\n"
|
||||
"PO-Revision-Date: 2023-02-28 19:36+0000\n"
|
||||
"Last-Translator: CloverGit <w991593239@163.com>\n"
|
||||
"Language-Team: Chinese (Simplified) <https://hosted.weblate.org/projects/"
|
||||
"kicad/master-source/zh_Hans/>\n"
|
||||
"kicad/v7/zh_Hans/>\n"
|
||||
"Language: zh_CN\n"
|
||||
"MIME-Version: 1.0\n"
|
||||
"Content-Type: text/plain; charset=UTF-8\n"
|
||||
"Content-Transfer-Encoding: 8bit\n"
|
||||
"Plural-Forms: nplurals=1; plural=0;\n"
|
||||
"X-Generator: Weblate 4.16-dev\n"
|
||||
"X-Generator: Weblate 4.16-rc\n"
|
||||
"X-Poedit-KeywordsList: _HKI;_\n"
|
||||
"X-Poedit-Basepath: ../../kicad-source-mirror\n"
|
||||
"X-Poedit-SourceCharset: UTF-8\n"
|
||||
|
@ -62,11 +62,11 @@ msgstr "未加载任何封装。"
|
|||
msgid ""
|
||||
"Footprint outline is missing or malformed. Run Footprint Checker for a full "
|
||||
"analysis."
|
||||
msgstr "封装轮廓缺失或畸形。运行封装检查器进行全面分析。"
|
||||
msgstr "封装轮廓缺失或格式不正确。可使用封装检查器进行全面分析。"
|
||||
|
||||
#: 3d-viewer/3d_canvas/board_adapter.cpp:694
|
||||
msgid "Board outline is missing or malformed. Run DRC for a full analysis."
|
||||
msgstr "电路板轮廓缺失或畸形。运行设计规则检查 (DRC) 进行全面分析。"
|
||||
msgstr "电路板轮廓缺失或格式不正确。可使用设计规则检查 (DRC) 进行全面分析。"
|
||||
|
||||
#: 3d-viewer/3d_canvas/create_layer_items.cpp:226
|
||||
msgid "Create tracks and vias"
|
||||
|
@ -286,7 +286,7 @@ msgstr "视图 (&V)"
|
|||
#: 3d-viewer/3d_viewer/3d_menubar.cpp:149 cvpcb/menubar.cpp:89
|
||||
#: gerbview/menubar.cpp:240 kicad/menubar.cpp:217
|
||||
msgid "&Preferences"
|
||||
msgstr "偏好设置 (&P)"
|
||||
msgstr "设置 (&P)"
|
||||
|
||||
#: 3d-viewer/3d_viewer/3d_toolbar.cpp:59
|
||||
#: pcbnew/widgets/appearance_controls.cpp:2731
|
||||
|
@ -1652,7 +1652,7 @@ msgstr "描述"
|
|||
msgid ""
|
||||
"The KiCad EDA Suite is a set of open source applications for the creation of "
|
||||
"electronic schematics and printed circuit boards."
|
||||
msgstr "KiCad EDA 工具箱是一套用于创建电路原理图和印刷电路板的开源应用软件。"
|
||||
msgstr "KiCad EDA 套件是一组开源应用程序,用于设计电路原理图和印刷电路板。"
|
||||
|
||||
#: common/dialog_about/AboutDialog_main.cpp:127
|
||||
msgid "KiCad on the web"
|
||||
|
@ -1816,12 +1816,12 @@ msgstr "报告 KiCad 的问题"
|
|||
|
||||
#: common/dialog_about/dialog_about_base.cpp:68 common/tool/actions.cpp:673
|
||||
msgid "Donate"
|
||||
msgstr "捐款"
|
||||
msgstr "捐赠"
|
||||
|
||||
#: common/dialog_about/dialog_about_base.cpp:69
|
||||
#: common/tool/common_control.cpp:278
|
||||
msgid "Donate to KiCad"
|
||||
msgstr "向 KiCad 捐款"
|
||||
msgstr "向 KiCad 捐赠"
|
||||
|
||||
#: common/dialog_about/dialog_about_base.cpp:94 common/dialog_shim.cpp:665
|
||||
msgid "&OK"
|
||||
|
@ -4003,7 +4003,7 @@ msgstr "偏好设置"
|
|||
#: common/eda_base_frame.cpp:1015 common/hotkey_store.cpp:71
|
||||
#: pcbnew/dialogs/dialog_track_via_properties_base.cpp:20
|
||||
msgid "Common"
|
||||
msgstr "共同"
|
||||
msgstr "通用"
|
||||
|
||||
#: common/eda_base_frame.cpp:1016
|
||||
msgid "Mouse and Touchpad"
|
||||
|
@ -6341,7 +6341,7 @@ msgstr "在 Web 浏览器中打开“参与 KiCad”"
|
|||
|
||||
#: common/tool/actions.cpp:674
|
||||
msgid "Open \"Donate to KiCad\" in a web browser"
|
||||
msgstr "在 Web 浏览器中打开“向 KiCad 捐款”"
|
||||
msgstr "在 Web 浏览器中打开“向 KiCad 捐赠”"
|
||||
|
||||
#: common/tool/actions.cpp:678
|
||||
msgid "Report Bug"
|
||||
|
@ -6391,7 +6391,7 @@ msgid ""
|
|||
"To donate to the KiCad project, visit %s"
|
||||
msgstr ""
|
||||
"无法启动默认浏览器。\n"
|
||||
"有关如何向 KiCad 项目捐款,请访问 %s"
|
||||
"有关如何向 KiCad 项目捐赠,请访问 %s"
|
||||
|
||||
#: common/tool/grid_menu.cpp:100
|
||||
#, c-format
|
||||
|
@ -8491,7 +8491,7 @@ msgstr "导出网表"
|
|||
#: eeschema/dialogs/dialog_export_netlist.cpp:320
|
||||
#: eeschema/sim/sim_plot_frame.cpp:463
|
||||
msgid "Simulator requires a fully annotated schematic."
|
||||
msgstr "仿真器需要一张完整批注的原理图。"
|
||||
msgstr "仿真器需要一张批注完整的原理图。"
|
||||
|
||||
#: eeschema/dialogs/dialog_export_netlist.cpp:348
|
||||
#: eeschema/dialogs/dialog_export_netlist.cpp:395
|
||||
|
@ -19342,15 +19342,15 @@ msgstr "将金属化孔 (PTH) 和非金属化孔 (NPTH) 放在不同文件中"
|
|||
|
||||
#: kicad/cli/command_export_pcb_drill.cpp:78
|
||||
msgid "Generate map / summary of drill hits"
|
||||
msgstr "生成钻击图/概述"
|
||||
msgstr "生成钻孔的映射/摘要"
|
||||
|
||||
#: kicad/cli/command_export_pcb_drill.cpp:84
|
||||
msgid "Valid options: pdf,gerberx2,ps,dxf,svg"
|
||||
msgstr "有效选项:pdf、gerberx2、ps、dxf、svg"
|
||||
msgstr "可用选项:pdf,gerberx2,ps,dxf,svg"
|
||||
|
||||
#: kicad/cli/command_export_pcb_drill.cpp:87
|
||||
msgid "Generate independent files for NPTH and PTH holes"
|
||||
msgstr "生成非金属化孔和金属化孔的独立文件"
|
||||
msgstr "为非金属化孔(NPTH)和金属化孔(PTH)生成独立文件"
|
||||
|
||||
#: kicad/cli/command_export_pcb_drill.cpp:92
|
||||
msgid "Precision of gerber coordinates (5 or 6)"
|
||||
|
@ -19581,9 +19581,8 @@ msgid "Schematic file does not exist or is not accessible\n"
|
|||
msgstr "原理图文件不存在或不可访问\n"
|
||||
|
||||
#: kicad/cli/command_export_sch_pdf.cpp:38
|
||||
#, fuzzy
|
||||
msgid "Color theme to use (will default to schematic settings)"
|
||||
msgstr "要使用的颜色主题(默认使用 pcbnew 设置)"
|
||||
msgstr "使用的颜色主题(默认为原理图设置)"
|
||||
|
||||
#: kicad/cli/command_export_sch_pdf.cpp:51
|
||||
#: kicad/cli/command_export_sch_svg.cpp:51
|
||||
|
@ -24764,15 +24763,15 @@ msgstr ""
|
|||
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:232 pcbnew/footprint.cpp:2883
|
||||
#: pcbnew/pad.cpp:1732 pcbnew/zone.cpp:1376
|
||||
msgid "Thermal reliefs"
|
||||
msgstr "防散热 (花焊盘)"
|
||||
msgstr "缓散热焊盘 (花焊盘)"
|
||||
|
||||
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:232
|
||||
msgid "Reliefs for PTH"
|
||||
msgstr "金属化孔 (PTH) 防散热"
|
||||
msgstr "仅金属化孔 (PTH) 使用缓散热焊盘 (花焊盘)"
|
||||
|
||||
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:238
|
||||
msgid "Thermal relief gap:"
|
||||
msgstr "防散热间距:"
|
||||
msgstr "缓散热焊盘 (花焊盘) 间距:"
|
||||
|
||||
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:240
|
||||
msgid ""
|
||||
|
@ -24786,11 +24785,11 @@ msgstr "在同一网中的焊盘和填充敷铜之间进行间隙处理。"
|
|||
|
||||
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:253
|
||||
msgid "Thermal spoke width:"
|
||||
msgstr "防散热导线宽度:"
|
||||
msgstr "缓散热焊盘 (花焊盘) 引线宽度:"
|
||||
|
||||
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:258
|
||||
msgid "Width of copper in thermal reliefs."
|
||||
msgstr "防散热 (花焊盘) 连接线的宽度。"
|
||||
msgstr "缓散热焊盘 (花焊盘) 连接线的宽度。"
|
||||
|
||||
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:278
|
||||
#: pcbnew/dialogs/dialog_non_copper_zones_properties_base.cpp:117
|
||||
|
@ -26377,7 +26376,7 @@ msgstr "使用敷铜设置"
|
|||
#: pcbnew/dialogs/dialog_footprint_properties_fp_editor_base.cpp:329
|
||||
#: pcbnew/dialogs/dialog_pad_properties_base.cpp:716
|
||||
msgid "Thermal relief"
|
||||
msgstr "防散热 (花焊盘)"
|
||||
msgstr "缓散热焊盘 (花焊盘)"
|
||||
|
||||
#: pcbnew/dialogs/dialog_footprint_properties_base.cpp:371
|
||||
#: pcbnew/dialogs/dialog_footprint_properties_fp_editor_base.cpp:396
|
||||
|
@ -27912,7 +27911,7 @@ msgstr "警告:测试点属性在\"非导通孔\"(NPTH)焊盘上没有意义
|
|||
|
||||
#: pcbnew/dialogs/dialog_pad_properties.cpp:1404
|
||||
msgid "Warning: Heatsink property makes no sense of NPTH pads."
|
||||
msgstr "警告:防散热片属性在\"非导通孔\"(NPTH) 焊盘上没有意义。"
|
||||
msgstr "警告:散热属性对于非金属化孔 (NPTH) 焊盘没有意义。"
|
||||
|
||||
#: pcbnew/dialogs/dialog_pad_properties.cpp:1410
|
||||
msgid "Warning: Castellated property is for PTH pads."
|
||||
|
@ -28324,7 +28323,7 @@ msgstr "花焊盘覆盖"
|
|||
|
||||
#: pcbnew/dialogs/dialog_pad_properties_base.cpp:747
|
||||
msgid "Relief gap:"
|
||||
msgstr "防散热间距:"
|
||||
msgstr "缓散热焊盘 (花焊盘) 间距:"
|
||||
|
||||
#: pcbnew/dialogs/dialog_pad_properties_base.cpp:758
|
||||
msgid "Spoke width:"
|
||||
|
@ -31755,12 +31754,12 @@ msgstr "%s 上的本地覆盖;敷铜连接:%s。"
|
|||
#: pcbnew/drc/drc_engine.cpp:811
|
||||
#, c-format
|
||||
msgid "Local override on %s; thermal relief gap: %s."
|
||||
msgstr "%s 上的本地覆盖;防散热间距:%s。"
|
||||
msgstr "%s 上的本地覆盖;缓散热焊盘 (花焊盘) 间距:%s。"
|
||||
|
||||
#: pcbnew/drc/drc_engine.cpp:828
|
||||
#, c-format
|
||||
msgid "Local override on %s; thermal spoke width: %s."
|
||||
msgstr "%s 上的本地覆盖;防散热导线宽度:%s。"
|
||||
msgstr "%s 上的本地覆盖;缓散热焊盘 (花焊盘) 引线宽度:%s。"
|
||||
|
||||
#: pcbnew/drc/drc_engine.cpp:837
|
||||
#, c-format
|
||||
|
@ -32728,7 +32727,7 @@ msgstr "(%s 最小辐条数 %d;实际 %d)"
|
|||
|
||||
#: pcbnew/drc/drc_test_provider_zone_connections.cpp:192
|
||||
msgid "Checking thermal reliefs..."
|
||||
msgstr "正在检查防散热..."
|
||||
msgstr "正在检查缓散热焊盘 (花焊盘) ..."
|
||||
|
||||
#: pcbnew/edit_zone_helpers.cpp:84 pcbnew/edit_zone_helpers.cpp:106
|
||||
msgid "Modify zone properties"
|
||||
|
@ -33104,7 +33103,7 @@ msgstr "继承"
|
|||
|
||||
#: pcbnew/footprint.cpp:2885 pcbnew/pad.cpp:1734 pcbnew/zone.cpp:1378
|
||||
msgid "Thermal reliefs for PTH"
|
||||
msgstr "用于金属化孔 (PTH) 的防散热"
|
||||
msgstr "用于金属化孔 (PTH) 的缓散热焊盘 (花焊盘)"
|
||||
|
||||
#: pcbnew/footprint.cpp:2927
|
||||
msgid "Library link"
|
||||
|
@ -34380,15 +34379,15 @@ msgstr "阻焊层边界覆盖"
|
|||
|
||||
#: pcbnew/pad.cpp:1833 pcbnew/zone.cpp:1504
|
||||
msgid "Thermal Relief Spoke Width"
|
||||
msgstr "防散热辐条宽度"
|
||||
msgstr "缓散热焊盘 (花焊盘) 引线宽度"
|
||||
|
||||
#: pcbnew/pad.cpp:1836
|
||||
msgid "Thermal Relief Spoke Angle"
|
||||
msgstr "防散热辐条角度"
|
||||
msgstr "缓散热焊盘 (花焊盘) 引线角度"
|
||||
|
||||
#: pcbnew/pad.cpp:1839 pcbnew/zone.cpp:1499
|
||||
msgid "Thermal Relief Gap"
|
||||
msgstr "防散热 (花焊盘) 间距"
|
||||
msgstr "缓散热焊盘 (花焊盘) 间距"
|
||||
|
||||
#: pcbnew/pcb_base_frame.cpp:194
|
||||
msgid "Error loading project footprint libraries."
|
||||
|
@ -35247,8 +35246,8 @@ msgid ""
|
|||
"and vias. KiCad only supports one single setting for both. The setting for "
|
||||
"pads has been applied."
|
||||
msgstr ""
|
||||
"CADSTAR 模板 '%s' 在焊盘和过孔中具有不同的防散热设置。KiCad 仅支持这两种设置"
|
||||
"的单一设置。已应用焊盘的设置。"
|
||||
"CADSTAR 模板 '%s' 在焊盘和过孔中具有不同的缓散热焊盘 (花焊盘) 设置。KiCad "
|
||||
"仅支持这两种设置的单一设置。已应用焊盘的设置。"
|
||||
|
||||
#: pcbnew/plugins/cadstar/cadstar_pcb_archive_loader.cpp:1945
|
||||
#, c-format
|
||||
|
@ -37056,12 +37055,12 @@ msgstr "敷铜连接解像度,用于:"
|
|||
|
||||
#: pcbnew/tools/board_inspection_tool.cpp:643
|
||||
msgid "Thermal relief gap resolution for:"
|
||||
msgstr "下列项目的防散热间距:"
|
||||
msgstr "下列项目的缓散热焊盘 (花焊盘) 间距:"
|
||||
|
||||
#: pcbnew/tools/board_inspection_tool.cpp:652
|
||||
#, c-format
|
||||
msgid "Resolved thermal relief gap: %s."
|
||||
msgstr "已解决的防散热间隙:%s。"
|
||||
msgstr "已解决的缓散热焊盘 (花焊盘) 间隙:%s。"
|
||||
|
||||
#: pcbnew/tools/board_inspection_tool.cpp:657
|
||||
msgid "Spoke width resolution for:"
|
||||
|
@ -37070,7 +37069,7 @@ msgstr "下列项目的辐条宽度分辨率:"
|
|||
#: pcbnew/tools/board_inspection_tool.cpp:666
|
||||
#, c-format
|
||||
msgid "Resolved thermal relief spoke width: %s."
|
||||
msgstr "已解析的防散热辐条宽度:%s。"
|
||||
msgstr "已解析的缓散热焊盘 (花焊盘) 引线宽度:%s。"
|
||||
|
||||
#: pcbnew/tools/board_inspection_tool.cpp:671
|
||||
msgid "Spoke count resolution for:"
|
||||
|
@ -40221,7 +40220,7 @@ msgstr "继承"
|
|||
|
||||
#: pcbnew/zones.h:66
|
||||
msgid "thermal reliefs"
|
||||
msgstr "防散热 (花焊盘)"
|
||||
msgstr "缓散热焊盘 (花焊盘)"
|
||||
|
||||
#: pcbnew/zones.h:67
|
||||
msgid "solid"
|
||||
|
@ -40229,7 +40228,7 @@ msgstr "实心"
|
|||
|
||||
#: pcbnew/zones.h:68
|
||||
msgid "thermal reliefs for PTH"
|
||||
msgstr "用于金属化孔 (PTH) 的防散热"
|
||||
msgstr "用于金属化孔 (PTH) 的缓散热焊盘 (花焊盘)"
|
||||
|
||||
#: plugins/3d/vrml/vrml.cpp:228
|
||||
msgid "[INFO] load failed: input line too long\n"
|
||||
|
@ -40286,7 +40285,7 @@ msgstr "KiCad"
|
|||
|
||||
#: resources/linux/launchers/org.kicad.kicad.desktop.in:12
|
||||
msgid "EDA Suite"
|
||||
msgstr "EDA 工具箱"
|
||||
msgstr "EDA 套件"
|
||||
|
||||
#: resources/linux/launchers/org.kicad.kicad.desktop.in:13
|
||||
msgid "Suite of tools for schematic design and circuit board layout"
|
||||
|
|
Loading…
Reference in New Issue