kicad/pcbnew/plot_board_layers.cpp

1180 lines
42 KiB
C++
Raw Normal View History

/**
* @file plot_board_layers.cpp
* @brief Functions to plot one board layer (silkscreen layers or other layers).
* Silkscreen layers have specific requirement for pads (not filled) and texts
* (with option to remove them from some copper areas (pads...)
*/
/*
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 1992-2020 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
* as published by the Free Software Foundation; either version 2
* of the License, or (at your option) any later version.
*
* This program is distributed in the hope that it will be useful,
* but WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
* GNU General Public License for more details.
*
* You should have received a copy of the GNU General Public License
* along with this program; if not, you may find one here:
* http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
* or you may search the http://www.gnu.org website for the version 2 license,
* or you may write to the Free Software Foundation, Inc.,
* 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
*/
2012-02-19 04:02:19 +00:00
#include <base_struct.h>
2018-04-20 00:20:48 +00:00
#include <geometry/geometry_utils.h>
#include <geometry/shape_segment.h>
2018-01-29 15:39:40 +00:00
#include <pcb_base_frame.h>
#include <math/util.h> // for KiROUND
2012-02-19 04:02:19 +00:00
#include <class_board.h>
#include <class_module.h>
#include <class_track.h>
#include <class_edge_mod.h>
#include <class_pcb_text.h>
#include <class_zone.h>
#include <class_drawsegment.h>
#include <class_pcb_target.h>
2012-02-19 04:02:19 +00:00
#include <class_dimension.h>
#include <pcbplot.h>
2020-04-14 12:25:00 +00:00
#include <pcb_painter.h>
#include <gbr_metadata.h>
/*
* Plot a solder mask layer. Solder mask layers have a minimum thickness value and cannot be
* drawn like standard layers, unless the minimum thickness is 0.
*/
static void PlotSolderMaskLayer( BOARD *aBoard, PLOTTER* aPlotter, LSET aLayerMask,
const PCB_PLOT_PARAMS& aPlotOpt, int aMinThickness );
void PlotOneBoardLayer( BOARD *aBoard, PLOTTER* aPlotter, PCB_LAYER_ID aLayer,
const PCB_PLOT_PARAMS& aPlotOpt )
{
PCB_PLOT_PARAMS plotOpt = aPlotOpt;
int soldermask_min_thickness = aBoard->GetDesignSettings().m_SolderMaskMinWidth;
// Set a default color and the text mode for this layer
aPlotter->SetColor( aPlotOpt.GetColor() );
aPlotter->SetTextMode( aPlotOpt.GetTextMode() );
// Specify that the contents of the "Edges Pcb" layer are to be plotted in addition to the
// contents of the currently specified layer.
LSET layer_mask( aLayer );
2009-06-29 05:30:08 +00:00
if( !aPlotOpt.GetExcludeEdgeLayer() )
layer_mask.set( Edge_Cuts );
if( IsCopperLayer( aLayer ) )
2009-06-29 05:30:08 +00:00
{
2012-08-29 16:59:50 +00:00
// Skip NPTH pads on copper layers ( only if hole size == pad size ):
// Drill mark will be plotted if drill mark is SMALL_DRILL_SHAPE or FULL_DRILL_SHAPE
2019-12-28 00:55:11 +00:00
if( plotOpt.GetFormat() == PLOT_FORMAT::DXF )
2014-05-17 19:29:15 +00:00
{
plotOpt.SetSkipPlotNPTH_Pads( false );
PlotLayerOutlines( aBoard, aPlotter, layer_mask, plotOpt );
}
else
{
plotOpt.SetSkipPlotNPTH_Pads( true );
PlotStandardLayer( aBoard, aPlotter, layer_mask, plotOpt );
}
}
else
{
switch( aLayer )
{
case B_Mask:
case F_Mask:
plotOpt.SetSkipPlotNPTH_Pads( false );
// Disable plot pad holes
plotOpt.SetDrillMarksType( PCB_PLOT_PARAMS::NO_DRILL_SHAPE );
2009-06-25 20:45:27 +00:00
// Plot solder mask:
if( soldermask_min_thickness == 0 )
{
2019-12-28 00:55:11 +00:00
if( plotOpt.GetFormat() == PLOT_FORMAT::DXF )
PlotLayerOutlines( aBoard, aPlotter, layer_mask, plotOpt );
else
PlotStandardLayer( aBoard, aPlotter, layer_mask, plotOpt );
}
else
PlotSolderMaskLayer( aBoard, aPlotter, layer_mask, plotOpt,
soldermask_min_thickness );
break;
case B_Adhes:
case F_Adhes:
case B_Paste:
case F_Paste:
plotOpt.SetSkipPlotNPTH_Pads( false );
// Disable plot pad holes
plotOpt.SetDrillMarksType( PCB_PLOT_PARAMS::NO_DRILL_SHAPE );
2019-12-28 00:55:11 +00:00
if( plotOpt.GetFormat() == PLOT_FORMAT::DXF )
2014-05-17 19:29:15 +00:00
PlotLayerOutlines( aBoard, aPlotter, layer_mask, plotOpt );
else
PlotStandardLayer( aBoard, aPlotter, layer_mask, plotOpt );
break;
case F_SilkS:
case B_SilkS:
2019-12-28 00:55:11 +00:00
if( plotOpt.GetFormat() == PLOT_FORMAT::DXF && plotOpt.GetDXFPlotPolygonMode() )
// PlotLayerOutlines() is designed only for DXF plotters.
// and must not be used for other plot formats
PlotLayerOutlines( aBoard, aPlotter, layer_mask, plotOpt );
else
PlotStandardLayer( aBoard, aPlotter, layer_mask, plotOpt );
2009-06-25 20:45:27 +00:00
// Gerber: Subtract soldermask from silkscreen if enabled
2019-12-28 00:55:11 +00:00
if( aPlotter->GetPlotterType() == PLOT_FORMAT::GERBER
&& plotOpt.GetSubtractMaskFromSilk() )
{
if( aLayer == F_SilkS )
layer_mask = LSET( F_Mask );
else
layer_mask = LSET( B_Mask );
2014-05-17 19:29:15 +00:00
// Create the mask to subtract by creating a negative layer polarity
aPlotter->SetLayerPolarity( false );
2009-06-25 20:45:27 +00:00
// Disable plot pad holes
plotOpt.SetDrillMarksType( PCB_PLOT_PARAMS::NO_DRILL_SHAPE );
// Plot the mask
PlotStandardLayer( aBoard, aPlotter, layer_mask, plotOpt );
}
break;
// These layers are plotted like silk screen layers.
// Mainly, pads on these layers are not filled.
// This is not necessary the best choice.
case Dwgs_User:
case Cmts_User:
case Eco1_User:
case Eco2_User:
case Edge_Cuts:
case Margin:
case F_CrtYd:
case B_CrtYd:
case F_Fab:
case B_Fab:
plotOpt.SetSkipPlotNPTH_Pads( false );
plotOpt.SetDrillMarksType( PCB_PLOT_PARAMS::NO_DRILL_SHAPE );
2019-12-28 00:55:11 +00:00
if( plotOpt.GetFormat() == PLOT_FORMAT::DXF && plotOpt.GetDXFPlotPolygonMode() )
// PlotLayerOutlines() is designed only for DXF plotters.
// and must not be used for other plot formats
PlotLayerOutlines( aBoard, aPlotter, layer_mask, plotOpt );
else
PlotStandardLayer( aBoard, aPlotter, layer_mask, plotOpt );
break;
default:
plotOpt.SetSkipPlotNPTH_Pads( false );
plotOpt.SetDrillMarksType( PCB_PLOT_PARAMS::NO_DRILL_SHAPE );
2019-12-28 00:55:11 +00:00
if( plotOpt.GetFormat() == PLOT_FORMAT::DXF && plotOpt.GetDXFPlotPolygonMode() )
// PlotLayerOutlines() is designed only for DXF plotters.
// and must not be used for other plot formats
PlotLayerOutlines( aBoard, aPlotter, layer_mask, plotOpt );
else
PlotStandardLayer( aBoard, aPlotter, layer_mask, plotOpt );
break;
}
}
}
2009-06-29 05:30:08 +00:00
/*
* Plot a copper layer or mask.
* Silk screen layers are not plotted here.
*/
void PlotStandardLayer( BOARD *aBoard, PLOTTER* aPlotter, LSET aLayerMask,
const PCB_PLOT_PARAMS& aPlotOpt )
{
BRDITEMS_PLOTTER itemplotter( aPlotter, aBoard, aPlotOpt );
itemplotter.SetLayerSet( aLayerMask );
EDA_DRAW_MODE_T plotMode = aPlotOpt.GetPlotMode();
bool onCopperLayer = ( LSET::AllCuMask() & aLayerMask ).any();
bool onSolderMaskLayer = ( LSET( 2, F_Mask, B_Mask ) & aLayerMask ).any();
bool onSolderPasteLayer = ( LSET( 2, F_Paste, B_Paste ) & aLayerMask ).any();
bool onFrontFab = ( LSET( F_Fab ) & aLayerMask ).any();
bool onBackFab = ( LSET( B_Fab ) & aLayerMask ).any();
bool sketchPads = ( onFrontFab || onBackFab ) && aPlotOpt.GetSketchPadsOnFabLayers();
// Plot edge layer and graphic items
itemplotter.PlotBoardGraphicItems();
// Draw footprint texts:
for( MODULE* module : aBoard->Modules() )
itemplotter.PlotFootprintTextItems( module );
// Draw footprint other graphic items:
for( MODULE* module : aBoard->Modules() )
itemplotter.PlotFootprintGraphicItems( module );
2012-02-19 04:02:19 +00:00
// Plot footprint pads
for( MODULE* module : aBoard->Modules() )
{
aPlotter->StartBlock( NULL );
for( D_PAD* pad : module->Pads() )
{
EDA_DRAW_MODE_T padPlotMode = plotMode;
if( !( pad->GetLayerSet() & aLayerMask ).any() )
{
if( sketchPads &&
( ( onFrontFab && pad->GetLayerSet().Contains( F_Cu ) ) ||
( onBackFab && pad->GetLayerSet().Contains( B_Cu ) ) ) )
padPlotMode = SKETCH;
else
continue;
}
/// pads not connected to copper are optionally not drawn
if( onCopperLayer && !pad->FlashLayer( aLayerMask ) )
continue;
COLOR4D color = COLOR4D::BLACK;
if( pad->GetLayerSet()[B_Cu] )
color = aPlotOpt.ColorSettings()->GetColor( LAYER_PAD_BK );
if( pad->GetLayerSet()[F_Cu] )
color = color.LegacyMix( aPlotOpt.ColorSettings()->GetColor( LAYER_PAD_FR ) );
if( sketchPads && aLayerMask[F_Fab] )
color = aPlotOpt.ColorSettings()->GetColor( F_Fab );
else if( sketchPads && aLayerMask[B_Fab] )
color = aPlotOpt.ColorSettings()->GetColor( B_Fab );
wxSize margin;
int width_adj = 0;
if( onCopperLayer )
width_adj = itemplotter.getFineWidthAdj();
if( onSolderMaskLayer )
margin.x = margin.y = pad->GetSolderMaskMargin();
if( onSolderPasteLayer )
margin = pad->GetSolderPasteMargin();
// Now offset the pad size by margin + width_adj
wxSize padPlotsSize = pad->GetSize() + margin * 2 + wxSize( width_adj, width_adj );
// Store these parameters that can be modified to plot inflated/deflated pads shape
PAD_SHAPE_T padShape = pad->GetShape();
wxSize padSize = pad->GetSize();
wxSize padDelta = pad->GetDelta(); // has meaning only for trapezoidal pads
double padCornerRadius = pad->GetRoundRectCornerRadius();
2012-02-19 04:02:19 +00:00
// Don't draw a null size item :
if( padPlotsSize.x <= 0 || padPlotsSize.y <= 0 )
continue;
2012-02-19 04:02:19 +00:00
switch( pad->GetShape() )
2009-06-29 05:30:08 +00:00
{
case PAD_SHAPE_CIRCLE:
case PAD_SHAPE_OVAL:
pad->SetSize( padPlotsSize );
if( aPlotOpt.GetSkipPlotNPTH_Pads() &&
( aPlotOpt.GetDrillMarksType() == PCB_PLOT_PARAMS::NO_DRILL_SHAPE ) &&
( pad->GetSize() == pad->GetDrillSize() ) &&
2020-09-30 15:38:35 +00:00
( pad->GetAttribute() == PAD_ATTRIB_NPTH ) )
break;
itemplotter.PlotPad( pad, color, padPlotMode );
break;
case PAD_SHAPE_RECT:
pad->SetSize( padPlotsSize );
if( margin.x > 0 )
{
pad->SetShape( PAD_SHAPE_ROUNDRECT );
pad->SetRoundRectCornerRadius( margin.x );
}
itemplotter.PlotPad( pad, color, padPlotMode );
break;
case PAD_SHAPE_TRAPEZOID:
{
wxSize scale( padPlotsSize.x / padSize.x, padPlotsSize.y / padSize.y );
pad->SetDelta( wxSize( padDelta.x * scale.x, padDelta.y * scale.y ) );
pad->SetSize( padPlotsSize );
itemplotter.PlotPad( pad, color, padPlotMode );
}
break;
2016-04-06 18:15:49 +00:00
case PAD_SHAPE_ROUNDRECT:
case PAD_SHAPE_CHAMFERED_RECT:
// Chamfer and rounding are stored as a percent and so don't need scaling
pad->SetSize( padPlotsSize );
itemplotter.PlotPad( pad, color, padPlotMode );
2009-06-29 05:30:08 +00:00
break;
case PAD_SHAPE_CUSTOM:
{
// inflate/deflate a custom shape is a bit complex.
// so build a similar pad shape, and inflate/deflate the polygonal shape
D_PAD dummy( *pad );
SHAPE_POLY_SET shape;
pad->MergePrimitivesAsPolygon( &shape, UNDEFINED_LAYER );
// Shape polygon can have holes so use InflateWithLinkedHoles(), not Inflate()
// which can create bad shapes if margin.x is < 0
int maxError = aBoard->GetDesignSettings().m_MaxError;
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
int numSegs = GetArcToSegmentCount( margin.x, maxError, 360.0 );
shape.InflateWithLinkedHoles( margin.x, numSegs, SHAPE_POLY_SET::PM_FAST );
dummy.DeletePrimitivesList();
dummy.AddPrimitivePoly( shape, 0 );
// Be sure the anchor pad is not bigger than the deflated shape because this
// anchor will be added to the pad shape when plotting the pad. So now the
// polygonal shape is built, we can clamp the anchor size
if( margin.x < 0 ) // we expect margin.x = margin.y for custom pads
dummy.SetSize( padPlotsSize );
itemplotter.PlotPad( &dummy, color, padPlotMode );
}
break;
2009-06-29 05:30:08 +00:00
}
// Restore the pad parameters modified by the plot code
pad->SetSize( padSize );
pad->SetDelta( padDelta );
pad->SetShape( padShape );
pad->SetRoundRectCornerRadius( padCornerRadius );
}
aPlotter->EndBlock( NULL );
}
// Plot vias on copper layers, and if aPlotOpt.GetPlotViaOnMaskLayer() is true,
// plot them on solder mask
GBR_METADATA gbr_metadata;
bool isOnCopperLayer = ( aLayerMask & LSET::AllCuMask() ).any();
if( isOnCopperLayer )
{
gbr_metadata.SetApertureAttrib( GBR_APERTURE_METADATA::GBR_APERTURE_ATTRIB_VIAPAD );
gbr_metadata.SetNetAttribType( GBR_NETLIST_METADATA::GBR_NETINFO_NET );
}
aPlotter->StartBlock( NULL );
2019-05-31 02:30:28 +00:00
for( auto track : aBoard->Tracks() )
{
const VIA* Via = dyn_cast<const VIA*>( track );
if( !Via )
continue;
// vias are not plotted if not on selected layer, but if layer is SOLDERMASK_LAYER_BACK
// or SOLDERMASK_LAYER_FRONT, vias are drawn only if they are on the corresponding
// external copper layer
LSET via_mask_layer = Via->GetLayerSet();
if( aPlotOpt.GetPlotViaOnMaskLayer() )
{
if( via_mask_layer[B_Cu] )
via_mask_layer.set( B_Mask );
if( via_mask_layer[F_Cu] )
via_mask_layer.set( F_Mask );
}
if( !( via_mask_layer & aLayerMask ).any() )
continue;
int via_margin = 0;
double width_adj = 0;
// If the current layer is a solder mask, use the global mask clearance for vias
if( aLayerMask[B_Mask] || aLayerMask[F_Mask] )
via_margin = aBoard->GetDesignSettings().m_SolderMaskMargin;
if( ( aLayerMask & LSET::AllCuMask() ).any() )
width_adj = itemplotter.getFineWidthAdj();
int diameter = Via->GetWidth() + 2 * via_margin + width_adj;
/// Vias not connected to copper are optionally not drawn
if( onCopperLayer && !Via->FlashLayer( aLayerMask ) )
continue;
// Don't draw a null size item :
if( diameter <= 0 )
continue;
// Some vias can be not connected (no net).
// Set the m_NotInNet for these vias to force a empty net name in gerber file
gbr_metadata.m_NetlistMetadata.m_NotInNet = Via->GetNetname().IsEmpty();
gbr_metadata.SetNetName( Via->GetNetname() );
COLOR4D color = aPlotOpt.ColorSettings()->GetColor(
LAYER_VIAS + static_cast<int>( Via->GetViaType() ) );
// Set plot color (change WHITE to LIGHTGRAY because the white items are not seen on a
// white paper or screen
aPlotter->SetColor( color != WHITE ? color : LIGHTGRAY );
aPlotter->FlashPadCircle( Via->GetStart(), diameter, plotMode, &gbr_metadata );
}
aPlotter->EndBlock( NULL );
aPlotter->StartBlock( NULL );
gbr_metadata.SetApertureAttrib( GBR_APERTURE_METADATA::GBR_APERTURE_ATTRIB_CONDUCTOR );
2012-02-19 04:02:19 +00:00
// Plot tracks (not vias) :
2019-05-31 02:30:28 +00:00
for( auto track : aBoard->Tracks() )
{
if( track->Type() == PCB_VIA_T )
continue;
2008-05-05 19:50:59 +00:00
if( !aLayerMask[track->GetLayer()] )
continue;
2008-05-05 19:50:59 +00:00
// Some track segments can be not connected (no net).
// Set the m_NotInNet for these segments to force a empty net name in gerber file
gbr_metadata.m_NetlistMetadata.m_NotInNet = track->GetNetname().IsEmpty();
gbr_metadata.SetNetName( track->GetNetname() );
int width = track->GetWidth() + itemplotter.getFineWidthAdj();
aPlotter->SetColor( itemplotter.getColor( track->GetLayer() ) );
if( track->Type() == PCB_ARC_T )
{
ARC* arc = static_cast<ARC*>( track );
VECTOR2D center( arc->GetCenter() );
auto radius = arc->GetRadius();
auto start_angle = arc->GetArcAngleStart();
auto end_angle = start_angle + arc->GetAngle();
aPlotter->ThickArc( wxPoint( center.x, center.y ), -end_angle, -start_angle,
radius, width, plotMode, &gbr_metadata );
}
else
aPlotter->ThickSegment( track->GetStart(), track->GetEnd(), width, plotMode, &gbr_metadata );
}
aPlotter->EndBlock( NULL );
2012-02-19 04:02:19 +00:00
// Plot filled ares
aPlotter->StartBlock( NULL );
// Plot all zones of the same layer & net together so we don't end up with divots where
// zones touch each other.
std::set<std::pair<PCB_LAYER_ID, ZONE_CONTAINER*>> plotted;
NETINFO_ITEM nonet( aBoard );
for( ZONE_CONTAINER* zone : aBoard->Zones() )
{
int outlineThickness = zone->GetFilledPolysUseThickness() ? zone->GetMinThickness() : 0;
for( PCB_LAYER_ID layer : zone->GetLayerSet().Seq() )
{
auto pair = std::make_pair( layer, zone );
if( !aLayerMask[layer] || plotted.count( pair ) )
continue;
plotted.insert( pair );
SHAPE_POLY_SET aggregateArea = zone->GetFilledPolysList( layer );
SHAPE_POLY_SET islands;
bool needFracture = false; // If 2 or more filled areas are combined, resulting
// aggregateArea will be simplified and fractured
// (Long calculation time)
2020-06-29 16:16:37 +00:00
for( int i = aggregateArea.OutlineCount() - 1; i >= 0; i-- )
{
if( zone->IsIsland( layer, i ) )
{
islands.AddOutline( aggregateArea.CPolygon( i )[0] );
aggregateArea.DeletePolygon( i );
}
}
for( ZONE_CONTAINER* candidate : aBoard->Zones() )
{
if( !candidate->IsOnLayer( layer ) )
continue;
auto candidate_pair = std::make_pair( layer, candidate );
if( plotted.count( candidate_pair ) )
continue;
if( candidate->GetNetCode() != zone->GetNetCode() )
continue;
// Merging zones of the same net can be done only for areas having compatible
// settings for filling as the merged zone can only have a single setting.
int candidateOutlineThickness = candidate->GetFilledPolysUseThickness() ?
candidate->GetMinThickness() : 0;
if( candidateOutlineThickness != outlineThickness )
continue;
plotted.insert( candidate_pair );
SHAPE_POLY_SET candidateArea = candidate->GetFilledPolysList( layer );
2020-06-29 16:16:37 +00:00
for( int i = candidateArea.OutlineCount() - 1; i >= 0; i-- )
{
if( candidate->IsIsland( layer, i ) )
{
islands.AddOutline( candidateArea.CPolygon( i )[0] );
candidateArea.DeletePolygon( i );
}
}
aggregateArea.Append( candidateArea );
needFracture = true;
}
if( needFracture )
{
aggregateArea.Unfracture( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
aggregateArea.Fracture( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
}
itemplotter.PlotFilledAreas( zone, aggregateArea );
if( !islands.IsEmpty() )
{
ZONE_CONTAINER dummy( *zone );
dummy.SetNet( &nonet );
itemplotter.PlotFilledAreas( &dummy, islands );
}
}
2009-06-29 05:30:08 +00:00
}
aPlotter->EndBlock( NULL );
// Adding drill marks, if required and if the plotter is able to plot them:
if( aPlotOpt.GetDrillMarksType() != PCB_PLOT_PARAMS::NO_DRILL_SHAPE )
itemplotter.PlotDrillMarks();
}
// Seems like we want to plot from back to front?
static const PCB_LAYER_ID plot_seq[] = {
B_Adhes, // 32
F_Adhes,
B_Paste,
F_Paste,
B_SilkS,
B_Mask,
F_Mask,
Dwgs_User,
Cmts_User,
Eco1_User,
Eco2_User,
Edge_Cuts,
Margin,
F_CrtYd, // CrtYd & Body are footprint only
B_CrtYd,
F_Fab,
B_Fab,
B_Cu,
In30_Cu,
In29_Cu,
In28_Cu,
In27_Cu,
In26_Cu,
In25_Cu,
In24_Cu,
In23_Cu,
In22_Cu,
In21_Cu,
In20_Cu,
In19_Cu,
In18_Cu,
In17_Cu,
In16_Cu,
In15_Cu,
In14_Cu,
In13_Cu,
In12_Cu,
In11_Cu,
In10_Cu,
In9_Cu,
In8_Cu,
In7_Cu,
In6_Cu,
In5_Cu,
In4_Cu,
In3_Cu,
In2_Cu,
In1_Cu,
F_Cu,
F_SilkS,
};
/*
* Plot outlines of copper, for copper layer
2014-05-17 19:29:15 +00:00
*/
void PlotLayerOutlines( BOARD* aBoard, PLOTTER* aPlotter, LSET aLayerMask,
const PCB_PLOT_PARAMS& aPlotOpt )
2014-05-17 19:29:15 +00:00
{
BRDITEMS_PLOTTER itemplotter( aPlotter, aBoard, aPlotOpt );
itemplotter.SetLayerSet( aLayerMask );
2014-05-17 19:29:15 +00:00
SHAPE_POLY_SET outlines;
2014-05-17 19:29:15 +00:00
for( LSEQ seq = aLayerMask.Seq( plot_seq, arrayDim( plot_seq ) ); seq; ++seq )
2014-05-17 19:29:15 +00:00
{
PCB_LAYER_ID layer = *seq;
2014-05-17 19:29:15 +00:00
outlines.RemoveAllContours();
aBoard->ConvertBrdLayerToPolygonalContours( layer, outlines );
outlines.Simplify( SHAPE_POLY_SET::PM_FAST );
2014-05-17 19:29:15 +00:00
// Plot outlines
std::vector<wxPoint> cornerList;
2014-05-17 19:29:15 +00:00
// Now we have one or more basic polygons: plot each polygon
for( int ii = 0; ii < outlines.OutlineCount(); ii++ )
2014-05-17 19:29:15 +00:00
{
for(int kk = 0; kk <= outlines.HoleCount (ii); kk++ )
{
cornerList.clear();
const SHAPE_LINE_CHAIN& path = (kk == 0) ? outlines.COutline( ii ) : outlines.CHole( ii, kk - 1 );
for( int jj = 0; jj < path.PointCount(); jj++ )
cornerList.emplace_back( (wxPoint) path.CPoint( jj ) );
2014-05-17 19:29:15 +00:00
// Ensure the polygon is closed
if( cornerList[0] != cornerList[cornerList.size() - 1] )
cornerList.push_back( cornerList[0] );
2014-05-17 19:29:15 +00:00
aPlotter->PlotPoly( cornerList, NO_FILL );
}
2014-05-17 19:29:15 +00:00
}
// Plot pad holes
if( aPlotOpt.GetDrillMarksType() != PCB_PLOT_PARAMS::NO_DRILL_SHAPE )
{
int smallDrill = (aPlotOpt.GetDrillMarksType() == PCB_PLOT_PARAMS::SMALL_DRILL_SHAPE)
? SMALL_DRILL : INT_MAX;
for( MODULE* module : aBoard->Modules() )
2014-05-17 19:29:15 +00:00
{
for( D_PAD* pad : module->Pads() )
2014-05-17 19:29:15 +00:00
{
wxSize hole = pad->GetDrillSize();
if( hole.x == 0 || hole.y == 0 )
continue;
if( hole.x == hole.y )
{
hole.x = std::min( smallDrill, hole.x );
2014-05-17 19:29:15 +00:00
aPlotter->Circle( pad->GetPosition(), hole.x, NO_FILL );
}
2014-05-17 19:29:15 +00:00
else
{
// Note: small drill marks have no significance when applied to slots
const SHAPE_SEGMENT* seg = pad->GetEffectiveHoleShape();
aPlotter->ThickSegment( (wxPoint) seg->GetSeg().A,
(wxPoint) seg->GetSeg().B,
seg->GetWidth(), SKETCH, NULL );
2014-05-17 19:29:15 +00:00
}
}
}
}
// Plot vias holes
for( TRACK* track : aBoard->Tracks() )
2014-05-17 19:29:15 +00:00
{
const VIA* via = dyn_cast<const VIA*>( track );
2014-05-17 19:29:15 +00:00
if( via && via->IsOnLayer( layer ) ) // via holes can be not through holes
{
aPlotter->Circle( via->GetPosition(), via->GetDrillValue(), NO_FILL );
}
}
}
}
/* Plot a solder mask layer.
* Solder mask layers have a minimum thickness value and cannot be drawn like standard layers,
* unless the minimum thickness is 0.
* Currently the algo is:
* 1 - build all pad shapes as polygons with a size inflated by
* mask clearance + (min width solder mask /2)
* 2 - Merge shapes
* 3 - deflate result by (min width solder mask /2)
* 4 - ORing result by all pad shapes as polygons with a size inflated by
* mask clearance only (because deflate sometimes creates shape artifacts)
* 5 - draw result as polygons
*
* We have 2 algos:
* the initial algo, that create polygons for every shape, inflate and deflate polygons
* with Min Thickness/2, and merges the result.
* Drawback: pads attributes are lost (annoying in Gerber)
* the new algo:
* create initial polygons for every shape (pad or polygon),
* inflate and deflate polygons
* with Min Thickness/2, and merges the result (like initial algo)
* remove all initial polygons.
* The remaining polygons are areas with thickness < min thickness
* plot all initial shapes by flashing (or using regions) for pad and polygons
* (shapes will be better) and remaining polygons to
* remove areas with thickness < min thickness from final mask
*
* TODO: remove old code after more testing.
*/
#define NEW_ALGO 1
void PlotSolderMaskLayer( BOARD *aBoard, PLOTTER* aPlotter, LSET aLayerMask,
const PCB_PLOT_PARAMS& aPlotOpt, int aMinThickness )
{
PCB_LAYER_ID layer = aLayerMask[B_Mask] ? B_Mask : F_Mask;
// Set the current arc to segment max approx error
int currMaxError = aBoard->GetDesignSettings().m_MaxError;
aBoard->GetDesignSettings().m_MaxError = Millimeter2iu( 0.005 );
// We remove 1nm as we expand both sides of the shapes, so allowing for
// a strictly greater than or equal comparison in the shape separation (boolean add)
// means that we will end up with separate shapes that then are shrunk
int inflate = aMinThickness/2 - 1;
BRDITEMS_PLOTTER itemplotter( aPlotter, aBoard, aPlotOpt );
itemplotter.SetLayerSet( aLayerMask );
// Plot edge layer and graphic items.
// They do not have a solder Mask margin, because they are graphic items
// on this layer (like logos), not actually areas around pads.
itemplotter.PlotBoardGraphicItems();
for( auto module : aBoard->Modules() )
{
for( auto item : module->GraphicalItems() )
{
itemplotter.PlotFootprintTextItems( module );
if( item->Type() == PCB_FP_SHAPE_T && item->GetLayer() == layer )
itemplotter.PlotFootprintGraphicItem((EDGE_MODULE*) item );
}
}
// Build polygons for each pad shape. The size of the shape on solder mask should be size
// of pad + clearance around the pad, where clearance = solder mask clearance + extra margin.
// Extra margin is half the min width for solder mask, which is used to merge too-close shapes
// (distance < aMinThickness), and will be removed when creating the actual shapes.
// Will contain shapes inflated by inflate value that will be merged and deflated by
// inflate value to build final polygons
// After calculations the remaining polygons are polygons to plot
SHAPE_POLY_SET areas;
// Will contain exact shapes of all items on solder mask
SHAPE_POLY_SET initialPolys;
#if NEW_ALGO
// Generate polygons with arcs inside the shape or exact shape
// to minimize shape changes created by arc to segment size correction.
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
DISABLE_ARC_RADIUS_CORRECTION disabler;
#endif
{
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
// Plot pads
for( auto module : aBoard->Modules() )
{
// add shapes with their exact mask layer size in initialPolys
module->TransformPadsShapesWithClearanceToPolygon( layer, initialPolys, 0 );
// add shapes inflated by aMinThickness/2 in areas
module->TransformPadsShapesWithClearanceToPolygon( layer, areas, inflate );
}
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
// Plot vias on solder masks, if aPlotOpt.GetPlotViaOnMaskLayer() is true,
if( aPlotOpt.GetPlotViaOnMaskLayer() )
{
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
// The current layer is a solder mask, use the global mask clearance for vias
int via_clearance = aBoard->GetDesignSettings().m_SolderMaskMargin;
int via_margin = via_clearance + inflate;
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
for( auto track : aBoard->Tracks() )
{
const VIA* via = dyn_cast<const VIA*>( track );
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
if( !via )
continue;
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
// vias are plotted only if they are on the corresponding external copper layer
LSET via_set = via->GetLayerSet();
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
if( via_set[B_Cu] )
via_set.set( B_Mask );
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
if( via_set[F_Cu] )
via_set.set( F_Mask );
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
if( !( via_set & aLayerMask ).any() )
continue;
// add shapes with their exact mask layer size in initialPolys
via->TransformShapeWithClearanceToPolygon( initialPolys, layer, via_clearance );
// add shapes inflated by aMinThickness/2 in areas
via->TransformShapeWithClearanceToPolygon( areas, layer, via_margin );
}
}
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
// Add filled zone areas.
#if 0 // Set to 1 if a solder mask margin must be applied to zones on solder mask
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
int zone_margin = aBoard->GetDesignSettings().m_SolderMaskMargin;
#else
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
int zone_margin = 0;
#endif
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
for( ZONE_CONTAINER* zone : aBoard->Zones() )
{
if( zone->GetLayer() != layer )
continue;
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
// add shapes inflated by aMinThickness/2 in areas
zone->TransformSmoothedOutlineWithClearanceToPolygon( areas, inflate + zone_margin );
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
// add shapes with their exact mask layer size in initialPolys
zone->TransformSmoothedOutlineWithClearanceToPolygon( initialPolys, zone_margin );
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
}
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
int maxError = aBoard->GetDesignSettings().m_MaxError;
int numSegs = GetArcToSegmentCount( inflate, maxError, 360.0 );
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
// Merge all polygons: After deflating, not merged (not overlapping) polygons
// will have the initial shape (with perhaps small changes due to deflating transform)
areas.Simplify( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
areas.Deflate( inflate, numSegs );
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
2020-09-10 23:05:20 +00:00
// Restore initial settings:
aBoard->GetDesignSettings().m_MaxError = currMaxError;
}
#if !NEW_ALGO
// To avoid a lot of code, use a ZONE_CONTAINER to handle and plot polygons, because our
// polygons look exactly like filled areas in zones.
// Note, also this code is not optimized: it creates a lot of copy/duplicate data.
// However it is not complex, and fast enough for plot purposes (copy/convert data is only a
// very small calculation time for these calculations).
ZONE_CONTAINER zone( aBoard );
zone.SetMinThickness( 0 ); // trace polygons only
zone.SetLayer( layer );
// Combine the current areas to initial areas. This is mandatory because inflate/deflate
// transform is not perfect, and we want the initial areas perfectly kept
areas.BooleanAdd( initialPolys, SHAPE_POLY_SET::PM_FAST );
areas.Fracture( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
itemplotter.PlotFilledAreas( &zone, areas );
#else
// Remove initial shapes: each shape will be added later, as flashed item or region
// with a suitable attribute.
// Do not merge pads is mandatory in Gerber files: They must be indentified as pads
// we deflate areas in polygons, to avoid after subtracting initial shapes
// having small artifacts due to approximations during polygon transforms
areas.BooleanSubtract( initialPolys, SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
// Slightly inflate polygons to avoid any gap between them and other shapes,
// These gaps are created by arc to segments approximations
areas.Inflate( Millimeter2iu( 0.002 ),6 );
// Now, only polygons with a too small thickness are stored in areas.
areas.Fracture( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
// Plot each initial shape (pads and polygons on mask layer), with suitable attributes:
PlotStandardLayer( aBoard, aPlotter, aLayerMask, aPlotOpt );
// Add shapes corresponding to areas having too small thickness.
std::vector<wxPoint> cornerList;
for( int ii = 0; ii < areas.OutlineCount(); ii++ )
{
cornerList.clear();
const SHAPE_LINE_CHAIN& path = areas.COutline( ii );
// polygon area in mm^2 :
double curr_area = path.Area() / ( IU_PER_MM * IU_PER_MM );
// Skip very small polygons: they are certainly artifacts created by
// arc approximations and polygon transforms
// (inflate/deflate transforms)
constexpr double poly_min_area_mm2 = 0.01; // 0.01 mm^2 gives a good filtering
if( curr_area < poly_min_area_mm2 )
continue;
for( int jj = 0; jj < path.PointCount(); jj++ )
cornerList.emplace_back( (wxPoint) path.CPoint( jj ) );
// Ensure the polygon is closed
if( cornerList[0] != cornerList[cornerList.size() - 1] )
cornerList.push_back( cornerList[0] );
aPlotter->PlotPoly( cornerList, FILLED_SHAPE );
}
#endif
}
/**
* Set up most plot options for plotting a board (especially the viewport)
2012-08-29 16:59:50 +00:00
* Important thing:
* page size is the 'drawing' page size,
* paper size is the physical page size
*/
static void initializePlotter( PLOTTER *aPlotter, BOARD * aBoard,
PCB_PLOT_PARAMS *aPlotOpts )
2012-08-29 16:59:50 +00:00
{
PAGE_INFO pageA4( wxT( "A4" ) );
const PAGE_INFO& pageInfo = aBoard->GetPageSettings();
2012-08-29 16:59:50 +00:00
const PAGE_INFO* sheet_info;
double paperscale; // Page-to-paper ratio
wxSize paperSizeIU;
wxSize pageSizeIU( pageInfo.GetSizeIU() );
2012-08-29 16:59:50 +00:00
bool autocenter = false;
// Special options: to fit the sheet to an A4 sheet replace the paper size. However there
// is a difference between the autoscale and the a4paper option:
// - Autoscale fits the board to the paper size
// - A4paper fits the original paper size to an A4 sheet
// - Both of them fit the board to an A4 sheet
if( aPlotOpts->GetA4Output() )
2012-08-29 16:59:50 +00:00
{
sheet_info = &pageA4;
paperSizeIU = pageA4.GetSizeIU();
paperscale = (double) paperSizeIU.x / pageSizeIU.x;
autocenter = true;
}
else
{
sheet_info = &pageInfo;
2012-08-29 16:59:50 +00:00
paperSizeIU = pageSizeIU;
paperscale = 1;
// Need autocentering only if scale is not 1:1
autocenter = (aPlotOpts->GetScale() != 1.0);
}
EDA_RECT bbox = aBoard->ComputeBoundingBox();
wxPoint boardCenter = bbox.Centre();
wxSize boardSize = bbox.GetSize();
2012-08-29 16:59:50 +00:00
double compound_scale;
// Fit to 80% of the page if asked; it could be that the board is empty, in this case
// regress to 1:1 scale
2012-08-29 16:59:50 +00:00
if( aPlotOpts->GetAutoScale() && boardSize.x > 0 && boardSize.y > 0 )
{
double xscale = (paperSizeIU.x * 0.8) / boardSize.x;
double yscale = (paperSizeIU.y * 0.8) / boardSize.y;
compound_scale = std::min( xscale, yscale ) * paperscale;
}
else
compound_scale = aPlotOpts->GetScale() * paperscale;
// For the plot offset we have to keep in mind the auxiliary origin too: if autoscaling is
// off we check that plot option (i.e. autoscaling overrides auxiliary origin)
2012-08-29 16:59:50 +00:00
wxPoint offset( 0, 0);
if( autocenter )
{
offset.x = KiROUND( boardCenter.x - ( paperSizeIU.x / 2.0 ) / compound_scale );
offset.y = KiROUND( boardCenter.y - ( paperSizeIU.y / 2.0 ) / compound_scale );
}
else
{
if( aPlotOpts->GetUseAuxOrigin() )
offset = aBoard->GetDesignSettings().m_AuxOrigin;
2012-08-29 16:59:50 +00:00
}
aPlotter->SetPageSettings( *sheet_info );
aPlotter->SetViewport( offset, IU_PER_MILS/10, compound_scale, aPlotOpts->GetMirror() );
// Has meaning only for gerber plotter. Must be called only after SetViewport
aPlotter->SetGerberCoordinatesFormat( aPlotOpts->GetGerberPrecision() );
// Has meaning only for SVG plotter. Must be called only after SetViewport
aPlotter->SetSvgCoordinatesFormat( aPlotOpts->GetSvgPrecision(), aPlotOpts->GetSvgUseInch() );
2012-08-29 16:59:50 +00:00
aPlotter->SetCreator( wxT( "PCBNEW" ) );
aPlotter->SetColorMode( false ); // default is plot in Black and White.
2012-08-29 16:59:50 +00:00
aPlotter->SetTextMode( aPlotOpts->GetTextMode() );
}
/**
* Prefill in black an area a little bigger than the board to prepare for the negative plot
*/
static void FillNegativeKnockout( PLOTTER *aPlotter, const EDA_RECT &aBbbox )
2012-08-29 16:59:50 +00:00
{
const int margin = 5 * IU_PER_MM; // Add a 5 mm margin around the board
2012-08-29 16:59:50 +00:00
aPlotter->SetNegative( true );
aPlotter->SetColor( WHITE ); // Which will be plotted as black
EDA_RECT area = aBbbox;
area.Inflate( margin );
aPlotter->Rect( area.GetOrigin(), area.GetEnd(), FILLED_SHAPE );
2012-08-29 16:59:50 +00:00
aPlotter->SetColor( BLACK );
}
/**
* Calculate the effective size of HPGL pens and set them in the plotter object
*/
static void ConfigureHPGLPenSizes( HPGL_PLOTTER *aPlotter, PCB_PLOT_PARAMS *aPlotOpts )
2012-08-29 16:59:50 +00:00
{
// Compute penDiam (the value is given in mils) in pcb units, with plot scale (if Scale is 2,
// penDiam value is always m_HPGLPenDiam so apparent penDiam is actually penDiam / Scale
int penDiam = KiROUND( aPlotOpts->GetHPGLPenDiameter() * IU_PER_MILS / aPlotOpts->GetScale() );
2012-08-29 16:59:50 +00:00
// Set HPGL-specific options and start
aPlotter->SetPenSpeed( aPlotOpts->GetHPGLPenSpeed() );
aPlotter->SetPenNumber( aPlotOpts->GetHPGLPenNum() );
aPlotter->SetPenDiameter( penDiam );
2012-08-29 16:59:50 +00:00
}
/**
* Open a new plotfile using the options (and especially the format) specified in the options
* and prepare the page for plotting.
* Return the plotter object if OK, NULL if the file is not created (or has a problem)
2012-08-29 16:59:50 +00:00
*/
PLOTTER* StartPlotBoard( BOARD *aBoard, PCB_PLOT_PARAMS *aPlotOpts, int aLayer,
const wxString& aFullFileName, const wxString& aSheetDesc )
2012-08-29 16:59:50 +00:00
{
// Create the plotter driver and set the few plotter specific options
PLOTTER* plotter = NULL;
2012-08-29 16:59:50 +00:00
switch( aPlotOpts->GetFormat() )
{
2019-12-28 00:55:11 +00:00
case PLOT_FORMAT::DXF:
DXF_PLOTTER* DXF_plotter;
DXF_plotter = new DXF_PLOTTER();
DXF_plotter->SetUnits(
static_cast<DXF_PLOTTER::DXF_UNITS>( aPlotOpts->GetDXFPlotUnits() ) );
plotter = DXF_plotter;
2012-08-29 16:59:50 +00:00
break;
2019-12-28 00:55:11 +00:00
case PLOT_FORMAT::POST:
2012-08-29 16:59:50 +00:00
PS_PLOTTER* PS_plotter;
PS_plotter = new PS_PLOTTER();
PS_plotter->SetScaleAdjust( aPlotOpts->GetFineScaleAdjustX(),
aPlotOpts->GetFineScaleAdjustY() );
plotter = PS_plotter;
2012-08-29 16:59:50 +00:00
break;
2019-12-28 00:55:11 +00:00
case PLOT_FORMAT::PDF:
plotter = new PDF_PLOTTER();
2012-08-29 16:59:50 +00:00
break;
2019-12-28 00:55:11 +00:00
case PLOT_FORMAT::HPGL:
2012-08-29 16:59:50 +00:00
HPGL_PLOTTER* HPGL_plotter;
HPGL_plotter = new HPGL_PLOTTER();
// HPGL options are a little more convoluted to compute, so they get their own function
2012-08-29 16:59:50 +00:00
ConfigureHPGLPenSizes( HPGL_plotter, aPlotOpts );
plotter = HPGL_plotter;
2012-08-29 16:59:50 +00:00
break;
2019-12-28 00:55:11 +00:00
case PLOT_FORMAT::GERBER:
plotter = new GERBER_PLOTTER();
2012-08-29 16:59:50 +00:00
break;
2019-12-28 00:55:11 +00:00
case PLOT_FORMAT::SVG:
plotter = new SVG_PLOTTER();
break;
2012-08-29 16:59:50 +00:00
default:
wxASSERT( false );
return NULL;
2012-08-29 16:59:50 +00:00
}
2020-04-14 12:25:00 +00:00
KIGFX::PCB_RENDER_SETTINGS* renderSettings = new KIGFX::PCB_RENDER_SETTINGS();
renderSettings->LoadColors( aPlotOpts->ColorSettings() );
plotter->SetRenderSettings( renderSettings );
// Compute the viewport and set the other options
// page layout is not mirrored, so temporarily change mirror option for the page layout
PCB_PLOT_PARAMS plotOpts = *aPlotOpts;
if( plotOpts.GetPlotFrameRef() && plotOpts.GetMirror() )
plotOpts.SetMirror( false );
initializePlotter( plotter, aBoard, &plotOpts );
2012-08-29 16:59:50 +00:00
if( plotter->OpenFile( aFullFileName ) )
{
plotter->ClearHeaderLinesList();
// For the Gerber "file function" attribute, set the layer number
2019-12-28 00:55:11 +00:00
if( plotter->GetPlotterType() == PLOT_FORMAT::GERBER )
{
bool useX2mode = plotOpts.GetUseGerberX2format();
GERBER_PLOTTER* gbrplotter = static_cast <GERBER_PLOTTER*> ( plotter );
gbrplotter->UseX2format( useX2mode );
gbrplotter->UseX2NetAttributes( plotOpts.GetIncludeGerberNetlistInfo() );
// Attributes can be added using X2 format or as comment (X1 format)
AddGerberX2Attribute( plotter, aBoard, aLayer, not useX2mode );
}
plotter->StartPlot();
// Plot the frame reference if requested
if( aPlotOpts->GetPlotFrameRef() )
{
PlotWorkSheet( plotter, aBoard->GetProject(), aBoard->GetTitleBlock(),
aBoard->GetPageSettings(), 1, 1, aSheetDesc, aBoard->GetFileName() );
if( aPlotOpts->GetMirror() )
initializePlotter( plotter, aBoard, aPlotOpts );
}
// When plotting a negative board: draw a black rectangle (background for plot board
// in white) and switch the current color to WHITE; note the color inversion is actually
// done in the driver (if supported)
if( aPlotOpts->GetNegative() )
2012-08-29 16:59:50 +00:00
{
EDA_RECT bbox = aBoard->ComputeBoundingBox();
FillNegativeKnockout( plotter, bbox );
2012-08-29 16:59:50 +00:00
}
return plotter;
2012-08-29 16:59:50 +00:00
}
2020-04-14 12:25:00 +00:00
delete plotter->RenderSettings();
delete plotter;
2012-08-29 16:59:50 +00:00
return NULL;
}