kicad/3d-viewer/3d_canvas/board_adapter.cpp

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/*
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2015-2016 Mario Luzeiro <mrluzeiro@ua.pt>
* Copyright (C) 1992-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
* as published by the Free Software Foundation; either version 2
* of the License, or (at your option) any later version.
*
* This program is distributed in the hope that it will be useful,
* but WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
* GNU General Public License for more details.
*
* You should have received a copy of the GNU General Public License
* along with this program; if not, you may find one here:
* http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
* or you may search the http://www.gnu.org website for the version 2 license,
* or you may write to the Free Software Foundation, Inc.,
* 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
*/
#include "../3d_rendering/camera.h"
#include "board_adapter.h"
#include <board_design_settings.h>
#include <board_stackup_manager/board_stackup.h>
#include <board_stackup_manager/stackup_predefined_prms.h>
#include <3d_rendering/raytracing/shapes2D/polygon_2d.h>
#include <board.h>
#include <dialogs/dialog_color_picker.h>
#include <3d_math.h>
#include "3d_fastmath.h"
#include <geometry/geometry_utils.h>
#include <convert_to_biu.h>
#include <pgm_base.h>
#include <settings/settings_manager.h>
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#include <wx/log.h>
#define DEFAULT_BOARD_THICKNESS Millimeter2iu( 1.6 )
#define DEFAULT_COPPER_THICKNESS Millimeter2iu( 0.035 ) // for 35 um
// The solder mask layer (and silkscreen) thickness
#define DEFAULT_TECH_LAYER_THICKNESS Millimeter2iu( 0.025 )
// The solder paste thickness is chosen bigger than the solder mask layer
// to be sure is covers the mask when overlapping.
#define SOLDERPASTE_LAYER_THICKNESS Millimeter2iu( 0.04 )
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_SilkscreenColors;
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_MaskColors;
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_PasteColors;
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_FinishColors;
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_BoardColors;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBackgroundTop;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBackgroundBot;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSilkscreen;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSolderMask;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSolderPaste;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSurfaceFinish;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBoardBody;
static bool g_ColorsLoaded = false;
/**
* Trace mask used to enable or disable the trace output of this class.
* The debug output can be turned on by setting the WXTRACE environment variable to
* "KI_TRACE_EDA_CINFO3D_VISU". See the wxWidgets documentation on wxLogTrace for
* more information.
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*
* @ingroup trace_env_vars
*/
const wxChar *BOARD_ADAPTER::m_logTrace = wxT( "KI_TRACE_EDA_CINFO3D_VISU" );
BOARD_ADAPTER::BOARD_ADAPTER() :
m_Cfg( nullptr ),
m_IsBoardView( true ),
m_MousewheelPanning( true ),
m_IsPreviewer( false ),
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m_board( nullptr ),
m_3dModelManager( nullptr ),
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m_colors( nullptr ),
m_layerZcoordTop(),
m_layerZcoordBottom()
{
wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::BOARD_ADAPTER" ) );
if( PgmOrNull() )
m_colors = Pgm().GetSettingsManager().GetColorSettings();
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m_boardPos = VECTOR2I();
m_boardSize = VECTOR2I();
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m_boardCenter = SFVEC3F( 0.0f );
m_boardBoundingBox.Reset();
m_throughHoleIds.Clear();
m_throughHoleOds.Clear();
m_throughHoleAnnularRings.Clear();
m_copperLayersCount = 2;
m_biuTo3Dunits = 1.0;
m_boardBodyThickness3DU = DEFAULT_BOARD_THICKNESS * m_biuTo3Dunits;
m_frontCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
m_backCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
m_nonCopperLayerThickness3DU = DEFAULT_TECH_LAYER_THICKNESS * m_biuTo3Dunits;
m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits;
m_trackCount = 0;
m_viaCount = 0;
m_averageViaHoleDiameter = 0.0f;
m_holeCount = 0;
m_averageHoleDiameter = 0.0f;
m_averageTrackWidth = 0.0f;
m_BgColorBot = SFVEC4F( 0.4, 0.4, 0.5, 1.0 );
m_BgColorTop = SFVEC4F( 0.8, 0.8, 0.9, 1.0 );
m_BoardBodyColor = SFVEC4F( 0.4, 0.4, 0.5, 0.9 );
m_SolderMaskColorTop = SFVEC4F( 0.1, 0.2, 0.1, 0.83 );
m_SolderMaskColorBot = SFVEC4F( 0.1, 0.2, 0.1, 0.83 );
m_SolderPasteColor = SFVEC4F( 0.4, 0.4, 0.4, 1.0 );
m_SilkScreenColorTop = SFVEC4F( 0.9, 0.9, 0.9, 1.0 );
m_SilkScreenColorBot = SFVEC4F( 0.9, 0.9, 0.9, 1.0 );
m_CopperColor = SFVEC4F( 0.75, 0.61, 0.23, 1.0 );
m_platedPadsFront = nullptr;
m_platedPadsBack = nullptr;
m_frontPlatedPadPolys = nullptr;
m_backPlatedPadPolys = nullptr;
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if( !g_ColorsLoaded )
{
#define ADD_COLOR( list, r, g, b, a, name ) \
list.push_back( CUSTOM_COLOR_ITEM( r/255.0, g/255.0, b/255.0, a, name ) )
ADD_COLOR( g_SilkscreenColors, 245, 245, 245, 1.0, NotSpecifiedPrm() ); // White
ADD_COLOR( g_SilkscreenColors, 20, 51, 36, 1.0, "Green" );
ADD_COLOR( g_SilkscreenColors, 181, 19, 21, 1.0, "Red" );
ADD_COLOR( g_SilkscreenColors, 2, 59, 162, 1.0, "Blue" );
ADD_COLOR( g_SilkscreenColors, 11, 11, 11, 1.0, "Black" );
ADD_COLOR( g_SilkscreenColors, 245, 245, 245, 1.0, "White" );
ADD_COLOR( g_SilkscreenColors, 32, 2, 53, 1.0, "Purple" );
ADD_COLOR( g_SilkscreenColors, 194, 195, 0, 1.0, "Yellow" );
ADD_COLOR( g_MaskColors, 20, 51, 36, 0.83, NotSpecifiedPrm() ); // Green
ADD_COLOR( g_MaskColors, 20, 51, 36, 0.83, "Green" );
ADD_COLOR( g_MaskColors, 91, 168, 12, 0.83, "Light Green" );
ADD_COLOR( g_MaskColors, 13, 104, 11, 0.83, "Saturated Green" );
ADD_COLOR( g_MaskColors, 181, 19, 21, 0.83, "Red" );
ADD_COLOR( g_MaskColors, 210, 40, 14, 0.83, "Light Red" );
ADD_COLOR( g_MaskColors, 239, 53, 41, 0.83, "Red/Orange" );
ADD_COLOR( g_MaskColors, 2, 59, 162, 0.83, "Blue" );
ADD_COLOR( g_MaskColors, 54, 79, 116, 0.83, "Light Blue 1" );
ADD_COLOR( g_MaskColors, 61, 85, 130, 0.83, "Light Blue 2" );
ADD_COLOR( g_MaskColors, 21, 70, 80, 0.83, "Green/Blue" );
ADD_COLOR( g_MaskColors, 11, 11, 11, 0.83, "Black" );
ADD_COLOR( g_MaskColors, 245, 245, 245, 0.83, "White" );
ADD_COLOR( g_MaskColors, 32, 2, 53, 0.83, "Purple" );
ADD_COLOR( g_MaskColors, 119, 31, 91, 0.83, "Light Purple" );
ADD_COLOR( g_MaskColors, 194, 195, 0, 0.83, "Yellow" );
ADD_COLOR( g_PasteColors, 128, 128, 128, 1.0, "Grey" );
ADD_COLOR( g_PasteColors, 90, 90, 90, 1.0, "Dark Grey" );
ADD_COLOR( g_PasteColors, 213, 213, 213, 1.0, "Silver" );
ADD_COLOR( g_FinishColors, 184, 115, 50, 1.0, "Copper" );
ADD_COLOR( g_FinishColors, 178, 156, 0, 1.0, "Gold" );
ADD_COLOR( g_FinishColors, 213, 213, 213, 1.0, "Silver" );
ADD_COLOR( g_FinishColors, 160, 160, 160, 1.0, "Tin" );
ADD_COLOR( g_BoardColors, 51, 43, 22, 0.83, "FR4 natural, dark" );
ADD_COLOR( g_BoardColors, 109, 116, 75, 0.83, "FR4 natural" );
ADD_COLOR( g_BoardColors, 252, 252, 250, 0.90, "PTFE natural" );
ADD_COLOR( g_BoardColors, 205, 130, 0, 0.68, "Polyimide" );
ADD_COLOR( g_BoardColors, 92, 17, 6, 0.90, "Phenolic natural" );
ADD_COLOR( g_BoardColors, 146, 99, 47, 0.83, "Brown 1" );
ADD_COLOR( g_BoardColors, 160, 123, 54, 0.83, "Brown 2" );
ADD_COLOR( g_BoardColors, 146, 99, 47, 0.83, "Brown 3" );
ADD_COLOR( g_BoardColors, 213, 213, 213, 1.0, "Aluminum" );
g_DefaultBackgroundTop = COLOR4D( 0.80, 0.80, 0.90, 1.0 );
g_DefaultBackgroundBot = COLOR4D( 0.40, 0.40, 0.50, 1.0 );
g_DefaultSilkscreen = COLOR4D( 0.94, 0.94, 0.94, 1.0 );
g_DefaultSolderMask = COLOR4D( 0.08, 0.20, 0.14, 0.83 );
g_DefaultSolderPaste = COLOR4D( 0.50, 0.50, 0.50, 1.0 );
g_DefaultSurfaceFinish = COLOR4D( 0.75, 0.61, 0.23, 1.0 );
g_DefaultBoardBody = COLOR4D( 0.43, 0.45, 0.30, 0.90 );
g_ColorsLoaded = true;
}
#undef ADD_COLOR
}
BOARD_ADAPTER::~BOARD_ADAPTER()
{
destroyLayers();
}
bool BOARD_ADAPTER::Is3dLayerEnabled( PCB_LAYER_ID aLayer ) const
{
wxASSERT( aLayer < PCB_LAYER_ID_COUNT );
if( m_board && !m_board->IsLayerEnabled( aLayer ) )
return false;
// see if layer needs to be shown
// check the flags
switch( aLayer )
{
case B_Adhes:
case F_Adhes:
return m_Cfg->m_Render.show_adhesive;
case B_Paste:
case F_Paste:
return m_Cfg->m_Render.show_solderpaste;
case B_SilkS:
case F_SilkS:
return m_Cfg->m_Render.show_silkscreen;
case B_Mask:
case F_Mask:
return m_Cfg->m_Render.show_soldermask;
case Dwgs_User:
case Cmts_User:
return !m_Cfg->m_Render.realistic && m_Cfg->m_Render.show_comments;
case Eco1_User:
case Eco2_User:
return !m_Cfg->m_Render.realistic && m_Cfg->m_Render.show_eco;
case Edge_Cuts:
return !m_Cfg->m_Render.realistic && !m_Cfg->m_Render.show_board_body;
case Margin:
return !m_Cfg->m_Render.realistic;
case B_Cu:
case F_Cu:
return !m_board || m_board->IsLayerVisible( aLayer ) || m_Cfg->m_Render.realistic;
default:
// the layer is an internal copper layer, used the visibility
return m_board && m_board->IsLayerVisible( aLayer );
}
}
bool BOARD_ADAPTER::IsFootprintShown( FOOTPRINT_ATTR_T aFPAttributes ) const
{
if( m_IsPreviewer ) // In panel Preview, footprints are always shown, of cource
return true;
if( aFPAttributes & FP_SMD )
return m_Cfg->m_Render.show_footprints_insert;
else if( aFPAttributes & FP_THROUGH_HOLE )
return m_Cfg->m_Render.show_footprints_normal;
else
return m_Cfg->m_Render.show_footprints_virtual;
}
int BOARD_ADAPTER::GetHolePlatingThickness() const noexcept
{
return m_board ? m_board->GetDesignSettings().GetHolePlatingThickness()
: DEFAULT_COPPER_THICKNESS;
}
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unsigned int BOARD_ADAPTER::GetCircleSegmentCount( float aDiameter3DU ) const
{
wxASSERT( aDiameter3DU > 0.0f );
return GetCircleSegmentCount( (int)( aDiameter3DU / m_biuTo3Dunits ) );
}
unsigned int BOARD_ADAPTER::GetCircleSegmentCount( int aDiameterBIU ) const
{
wxASSERT( aDiameterBIU > 0 );
Clean up arc/circle polygonization. 1) For a while now we've been using a calculated seg count from a given maxError, and a correction factor to push the radius out so that all the error is outside the arc/circle. However, the second calculation (which pre-dates the first) is pretty much just the inverse of the first (and yields nothing more than maxError back). This is particularly sub-optimal given the cost of trig functions. 2) There are a lot of old optimizations to reduce segcounts in certain situations, someting that our error-based calculation compensates for anyway. (Smaller radii need fewer segments to meet the maxError condition.) But perhaps more importantly we now surface maxError in the UI and we don't really want to call it "Max deviation except when it's not". 3) We were also clamping the segCount twice: once in the calculation routine and once in most of it's callers. Furthermore, the caller clamping was inconsistent (both in being done and in the clamping value). We now clamp only in the calculation routine. 4) There's no reason to use the correction factors in the 3Dviewer; it's just a visualization and whether the polygonization error is inside or outside the shape isn't really material. 5) The arc-correction-disabling stuff (used for solder mask layer) was somewhat fragile in that it depended on the caller to turn it back on afterwards. It's now only exposed as a RAII object which automatically cleans up when it goes out of scope. 6) There were also bugs in a couple of the polygonization routines where we'd accumulate round-off error in adding up the segments and end up with an overly long last segment (which of course would voilate the error max). This was the cause of the linked bug and also some issues with vias that we had fudged in the past with extra clearance. Fixes https://gitlab.com/kicad/code/kicad/issues/5567
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return GetArcToSegmentCount( aDiameterBIU / 2, ARC_HIGH_DEF, 360.0 );
}
void BOARD_ADAPTER::InitSettings( REPORTER* aStatusReporter, REPORTER* aWarningReporter )
{
wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::InitSettings" ) );
if( aStatusReporter )
aStatusReporter->Report( _( "Build board outline" ) );
wxString msg;
const bool haveOutline = createBoardPolygon( &msg );
if( aWarningReporter )
{
if( !haveOutline )
aWarningReporter->Report( msg, RPT_SEVERITY_WARNING );
else
aWarningReporter->Report( wxEmptyString );
}
EDA_RECT bbbox;
if( m_board )
{
bbbox = m_board->ComputeBoundingBox( !m_board->IsFootprintHolder()
&& m_Cfg->m_Render.realistic
&& haveOutline );
}
// Gives a non null size to avoid issues in zoom / scale calculations
if( ( bbbox.GetWidth() == 0 ) && ( bbbox.GetHeight() == 0 ) )
bbbox.Inflate( Millimeter2iu( 10 ) );
m_boardSize = bbbox.GetSize();
m_boardPos = bbbox.Centre();
wxASSERT( (m_boardSize.x > 0) && (m_boardSize.y > 0) );
m_boardPos.y = -m_boardPos.y; // The y coord is inverted in 3D viewer
m_copperLayersCount = m_board ? m_board->GetCopperLayerCount() : 2;
// Ensure the board has 2 sides for 3D views, because it is hard to find
// a *really* single side board in the true life...
if( m_copperLayersCount < 2 )
m_copperLayersCount = 2;
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// Calculate the conversion to apply to all positions.
m_biuTo3Dunits = RANGE_SCALE_3D / std::max( m_boardSize.x, m_boardSize.y );
m_boardBodyThickness3DU = DEFAULT_BOARD_THICKNESS * m_biuTo3Dunits;
m_frontCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
m_backCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
m_nonCopperLayerThickness3DU = DEFAULT_TECH_LAYER_THICKNESS * m_biuTo3Dunits;
m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits;
if( m_board )
{
const BOARD_DESIGN_SETTINGS& bds = m_board->GetDesignSettings();
if( bds.GetStackupDescriptor().GetCount() )
{
int thickness = 0;
for( BOARD_STACKUP_ITEM* item : bds.GetStackupDescriptor().GetList() )
{
switch( item->GetType() )
{
case BS_ITEM_TYPE_DIELECTRIC:
thickness += item->GetThickness();
break;
case BS_ITEM_TYPE_COPPER:
if( item->GetBrdLayerId() == F_Cu )
m_frontCopperThickness3DU = item->GetThickness() * m_biuTo3Dunits;
else if( item->GetBrdLayerId() == B_Cu )
m_backCopperThickness3DU = item->GetThickness() * m_biuTo3Dunits;
else if( item->IsEnabled() )
thickness += item->GetThickness();
break;
default:
break;
}
}
m_boardBodyThickness3DU = thickness * m_biuTo3Dunits;
}
}
// Init Z position of each layer
// calculate z position for each copper layer
// Zstart = -m_epoxyThickness / 2.0 is the z position of the back (bottom layer) (layer id = 31)
// Zstart = +m_epoxyThickness / 2.0 is the z position of the front (top layer) (layer id = 0)
// ____==__________==________==______ <- Bottom = +m_epoxyThickness / 2.0,
// | | Top = Bottom + m_copperThickness
// |__________________________________|
// == == == == <- Bottom = -m_epoxyThickness / 2.0,
// Top = Bottom - m_copperThickness
unsigned int layer;
for( layer = 0; layer < m_copperLayersCount; ++layer )
{
// This approximates internal layer positions (because we're treating all the dielectric
// layers as having the same thickness). But we don't render them anyway so it doesn't
// really matter.
m_layerZcoordBottom[layer] = m_boardBodyThickness3DU / 2.0f -
(m_boardBodyThickness3DU * layer / (m_copperLayersCount - 1) );
if( layer < (m_copperLayersCount / 2) )
m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] + m_frontCopperThickness3DU;
else
m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] - m_backCopperThickness3DU;
}
#define layerThicknessMargin 1.1
const float zpos_offset = m_nonCopperLayerThickness3DU * layerThicknessMargin;
// Fill remaining unused copper layers and back layer zpos with -m_boardBodyThickness / 2.0
for( ; layer < MAX_CU_LAYERS; layer++ )
{
m_layerZcoordBottom[layer] = -( m_boardBodyThickness3DU / 2.0f );
m_layerZcoordTop[layer] = -( m_boardBodyThickness3DU / 2.0f ) - m_backCopperThickness3DU;
}
// This is the top of the copper layer thickness.
const float zpos_copperTop_back = m_layerZcoordTop[B_Cu];
const float zpos_copperTop_front = m_layerZcoordTop[F_Cu];
// calculate z position for each non copper layer
// Solder mask and Solder paste have the same Z position
for( int layer_id = MAX_CU_LAYERS; layer_id < PCB_LAYER_ID_COUNT; ++layer_id )
{
float zposTop;
float zposBottom;
switch( layer_id )
{
case B_Adhes:
zposBottom = zpos_copperTop_back - 2.0f * zpos_offset;
zposTop = zposBottom - m_nonCopperLayerThickness3DU;
break;
case F_Adhes:
zposBottom = zpos_copperTop_front + 2.0f * zpos_offset;
zposTop = zposBottom + m_nonCopperLayerThickness3DU;
break;
case B_Mask:
zposBottom = zpos_copperTop_back;
zposTop = zpos_copperTop_back - m_nonCopperLayerThickness3DU;
break;
case B_Paste:
zposBottom = zpos_copperTop_back;
zposTop = zpos_copperTop_back - m_solderPasteLayerThickness3DU;
break;
case F_Mask:
zposBottom = zpos_copperTop_front;
zposTop = zpos_copperTop_front + m_nonCopperLayerThickness3DU;
break;
case F_Paste:
zposBottom = zpos_copperTop_front;
zposTop = zpos_copperTop_front + m_solderPasteLayerThickness3DU;
break;
case B_SilkS:
zposBottom = zpos_copperTop_back - 1.0f * zpos_offset;
zposTop = zposBottom - m_nonCopperLayerThickness3DU;
break;
case F_SilkS:
zposBottom = zpos_copperTop_front + 1.0f * zpos_offset;
zposTop = zposBottom + m_nonCopperLayerThickness3DU;
break;
// !TODO: review
default:
zposTop = zpos_copperTop_front + (layer_id - MAX_CU_LAYERS + 3.0f) * zpos_offset;
zposBottom = zposTop - m_nonCopperLayerThickness3DU;
break;
}
m_layerZcoordTop[layer_id] = zposTop;
m_layerZcoordBottom[layer_id] = zposBottom;
}
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m_boardCenter = SFVEC3F( m_boardPos.x * m_biuTo3Dunits, m_boardPos.y * m_biuTo3Dunits, 0.0f );
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SFVEC3F boardSize = SFVEC3F( m_boardSize.x * m_biuTo3Dunits, m_boardSize.y * m_biuTo3Dunits,
0.0f );
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boardSize /= 2.0f;
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SFVEC3F boardMin = ( m_boardCenter - boardSize );
SFVEC3F boardMax = ( m_boardCenter + boardSize );
boardMin.z = m_layerZcoordTop[B_Adhes];
boardMax.z = m_layerZcoordTop[F_Adhes];
m_boardBoundingBox = BBOX_3D( boardMin, boardMax );
#ifdef PRINT_STATISTICS_3D_VIEWER
unsigned stats_startCreateBoardPolyTime = GetRunningMicroSecs();
#endif
if( aStatusReporter )
aStatusReporter->Report( _( "Create layers" ) );
createLayers( aStatusReporter );
COLOR_SETTINGS* colors = Pgm().GetSettingsManager().GetColorSettings();
auto to_SFVEC4F =
[]( const COLOR4D& src )
{
return SFVEC4F( src.r, src.g, src.b, src.a );
};
m_BgColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_BACKGROUND_TOP ) );
m_BgColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_BACKGROUND_BOTTOM ) );
m_SolderPasteColor = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERPASTE ) );
if( m_board && colors->GetUseBoardStackupColors() )
{
const BOARD_STACKUP& stackup = m_board->GetDesignSettings().GetStackupDescriptor();
auto findColor =
[]( const wxString& aColorName, const CUSTOM_COLORS_LIST& aColorSet )
{
if( aColorName.StartsWith( "#" ) )
{
return KIGFX::COLOR4D( aColorName );
}
else
{
for( const CUSTOM_COLOR_ITEM& color : aColorSet )
{
if( color.m_ColorName == aColorName )
return color.m_Color;
}
}
return KIGFX::COLOR4D();
};
m_SilkScreenColorTop = to_SFVEC4F( g_DefaultSilkscreen );
m_SilkScreenColorBot = to_SFVEC4F( g_DefaultSilkscreen );
m_SolderMaskColorTop = to_SFVEC4F( g_DefaultSolderMask );
m_SolderMaskColorBot = to_SFVEC4F( g_DefaultSolderMask );
KIGFX::COLOR4D bodyColor( 0, 0, 0, 0 );
for( const BOARD_STACKUP_ITEM* stackupItem : stackup.GetList() )
{
wxString colorName = stackupItem->GetColor();
switch( stackupItem->GetType() )
{
case BS_ITEM_TYPE_SILKSCREEN:
if( stackupItem->GetBrdLayerId() == F_SilkS )
m_SilkScreenColorTop = to_SFVEC4F( findColor( colorName, g_SilkscreenColors ) );
else
m_SilkScreenColorBot = to_SFVEC4F( findColor( colorName, g_SilkscreenColors ) );
break;
case BS_ITEM_TYPE_SOLDERMASK:
if( stackupItem->GetBrdLayerId() == F_Mask )
m_SolderMaskColorTop = to_SFVEC4F( findColor( colorName, g_MaskColors ) );
else
m_SolderMaskColorBot = to_SFVEC4F( findColor( colorName, g_MaskColors ) );
break;
case BS_ITEM_TYPE_DIELECTRIC:
{
KIGFX::COLOR4D layerColor = findColor( colorName, g_BoardColors );
if( bodyColor == COLOR4D( 0, 0, 0, 0 ) )
bodyColor = layerColor;
else
bodyColor = bodyColor.Mix( layerColor, 1.0 - layerColor.a );
bodyColor.a += ( 1.0 - bodyColor.a ) * layerColor.a / 2;
break;
}
default:
break;
}
}
if( bodyColor != COLOR4D( 0, 0, 0, 0 ) )
m_BoardBodyColor = to_SFVEC4F( bodyColor );
else
m_BoardBodyColor = to_SFVEC4F( g_DefaultBoardBody );
const wxString& finishName = stackup.m_FinishType;
if( finishName.EndsWith( "OSP" ) )
{
m_CopperColor = to_SFVEC4F( findColor( "Copper", g_FinishColors ) );
}
else if( finishName.EndsWith( "IG" )
|| finishName.EndsWith( "gold" ) )
{
m_CopperColor = to_SFVEC4F( findColor( "Gold", g_FinishColors ) );
}
else if( finishName.StartsWith( "HAL" )
|| finishName.StartsWith( "HASL" )
|| finishName.EndsWith( "tin" )
|| finishName.EndsWith( "nickel" ) )
{
m_CopperColor = to_SFVEC4F( findColor( "Tin", g_FinishColors ) );
}
else if( finishName.EndsWith( "silver" ) )
{
m_CopperColor = to_SFVEC4F( findColor( "Silver", g_FinishColors ) );
}
else
{
m_CopperColor = to_SFVEC4F( g_DefaultSurfaceFinish );
}
}
else
{
m_SilkScreenColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_SILKSCREEN_BOTTOM ) );
m_SilkScreenColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_SILKSCREEN_TOP ) );
m_SolderMaskColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERMASK_BOTTOM ) );
m_SolderMaskColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERMASK_TOP ) );
m_CopperColor = to_SFVEC4F( colors->GetColor( LAYER_3D_COPPER ) );
m_BoardBodyColor = to_SFVEC4F( colors->GetColor( LAYER_3D_BOARD ) );
}
}
extern bool BuildFootprintPolygonOutlines( BOARD* aBoard, SHAPE_POLY_SET& aOutlines,
2020-12-24 21:35:31 +00:00
int aErrorMax, int aChainingEpsilon,
OUTLINE_ERROR_HANDLER* aErrorHandler = nullptr );
bool BOARD_ADAPTER::createBoardPolygon( wxString* aErrorMsg )
{
m_board_poly.RemoveAllContours();
if( !m_board )
return false;
bool success;
if( m_board->IsFootprintHolder() )
{
if( !m_board->GetFirstFootprint() )
{
if( aErrorMsg )
*aErrorMsg = _( "No footprint loaded." );
return false;
}
int chainingEpsilon = Millimeter2iu( 0.02 ); // max dist from one endPt to next startPt
success = BuildFootprintPolygonOutlines( m_board, m_board_poly,
m_board->GetDesignSettings().m_MaxError,
chainingEpsilon );
// Make polygon strictly simple to avoid issues (especially in 3D viewer)
m_board_poly.Simplify( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
if( !success && aErrorMsg )
{
*aErrorMsg = _( "Footprint outline is missing or malformed. Run Footprint Checker for "
"a full analysis." );
}
}
else
{
success = m_board->GetBoardPolygonOutlines( m_board_poly );
if( !success && aErrorMsg )
*aErrorMsg = _( "Board outline is missing or malformed. Run DRC for a full analysis." );
}
return success;
}
float BOARD_ADAPTER::GetFootprintZPos( bool aIsFlipped ) const
{
if( aIsFlipped )
{
if( m_Cfg->m_Render.show_solderpaste )
return m_layerZcoordBottom[B_SilkS];
else
return m_layerZcoordBottom[B_Paste];
}
else
{
if( m_Cfg->m_Render.show_solderpaste )
return m_layerZcoordTop[F_SilkS];
else
return m_layerZcoordTop[F_Paste];
}
}
SFVEC4F BOARD_ADAPTER::GetLayerColor( PCB_LAYER_ID aLayerId ) const
{
wxASSERT( aLayerId < PCB_LAYER_ID_COUNT );
const COLOR4D color = m_colors->GetColor( aLayerId );
return SFVEC4F( color.r, color.g, color.b, color.a );
}
SFVEC4F BOARD_ADAPTER::GetItemColor( int aItemId ) const
{
return GetColor( m_colors->GetColor( aItemId ) );
}
SFVEC4F BOARD_ADAPTER::GetColor( const COLOR4D& aColor ) const
{
return SFVEC4F( aColor.r, aColor.g, aColor.b, aColor.a );
}
SFVEC2F BOARD_ADAPTER::GetSphericalCoord( int i ) const
{
SFVEC2F sphericalCoord =
SFVEC2F( ( m_Cfg->m_Render.raytrace_lightElevation[i] + 90.0f ) / 180.0f,
m_Cfg->m_Render.raytrace_lightAzimuth[i] / 180.0f );
sphericalCoord.x = glm::clamp( sphericalCoord.x, 0.0f, 1.0f );
sphericalCoord.y = glm::clamp( sphericalCoord.y, 0.0f, 2.0f );
return sphericalCoord;
}